The **ATS-18H-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or power transistors. ### Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 1.15°C/W @ 100 LFM | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### Key Electronic & Mechanical Features #### 1. Heat Sink Design (Cross-Cut) The "H" in the part number often refers to the **Cross-Cut** fin pattern. This design allows for multidirectional airflow, meaning it can dissipate heat effectively regardless of whether the air is blowing horizontally or vertically across the PCB. #### 2. pushPIN™ Attachment Mechanism Unlike adhesive-based heat sinks, this part uses a mechanical **Push-Pin** system with a compression spring. * **Reliability:** Provides consistent pressure across the component surface, ensuring optimal contact. * **Ease of Assembly:** Can be installed manually or with automated equipment through pre-drilled holes in the PCB. #### 3. Thermal Interface Material (TIM) The unit comes with **T412** thermal grease/pad pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink and the electronic chip. * **Benefit:** Reduces contact resistance, allowing heat to flow more efficiently from the silicon to the aluminum fins. #### 4. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** Provides corrosion resistance and increases surface emissivity, which slightly improves radiant heat transfer. --- ### Application Usage This part is typically used in environments where high-power components are packed into tight spaces, such as: * **Telecommunications:** High-speed routers and switches. * **Industrial PC:** Embedded controllers. * **Power Supplies:** High-wattage DC-DC converters.