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  • ATS-18H-147-C2-R0

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    The **ATS-18H-147-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for cooling electronic components such as BGA (Ball Grid Array) chips, CPUs, and GPUs. --- ### ## Technical Specifications The following table outlines the key physical and thermal properties of the part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-18H-147-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Fin Type** | Straight | | **Dimensions** | 35.00mm x 35.00mm x 10.00mm | | **Thermal Resistance (Unducted)** | 16.28 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.48 °C/W @ 100 LFM | | **Weight** | ~35 grams | --- ### ### Key Electronic/Mechanical Features #### 1. pushPIN™ Attachment System The "R0" at the end of the part number indicates the specific attachment kit. This system uses a flexible, spring-loaded mechanism that ensures: * **Constant Pressure:** Provides uniform contact between the heat sink and the component, optimizing heat transfer. * **Secure Fit:** Prevents the heat sink from shifting due to vibration or shock. #### 2. Thermal Interface Material (TIM) This specific model usually comes pre-applied with **ATS-PPS-18**, a high-performance thermal interface material. This eliminates the need for external thermal paste and ensures the microscopic gaps between the chip and the aluminum are filled for maximum efficiency. #### 3. Straight Fin Profile The straight fin design is optimized for **forced-air cooling** (fans). The spacing between the fins is engineered to minimize pressure drop while maximizing surface area for heat dissipation. --- ### ### Application Considerations * **Form Factor:** The low profile (10mm height) makes it ideal for dense PCB layouts and 1U server chassis. * **Flow Direction:** Because it uses straight fins, the airflow should ideally be directed along the length of the fins for peak performance. * **Component Compatibility:** Best suited for chips with a footprint around 35mm x 35mm.
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted thermal resistance?
    • ⤷ Can this heat sink be used with a custom clip instead of the pushPIN?
    • ⤷ Does the blue anodized finish impact the thermal performance?