ATS-18H-147-C2-R0
AI

The **ATS-18H-147-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for cooling electronic components such as BGA (Ball Grid Array) chips, CPUs, and GPUs.
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### ## Technical Specifications
The following table outlines the key physical and thermal properties of the part:
| Parameter | Specification |
| :--- | :--- |
| **Part Number** | ATS-18H-147-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Fin Type** | Straight |
| **Dimensions** | 35.00mm x 35.00mm x 10.00mm |
| **Thermal Resistance (Unducted)** | 16.28 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 2.48 °C/W @ 100 LFM |
| **Weight** | ~35 grams |
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### ### Key Electronic/Mechanical Features
#### 1. pushPIN™ Attachment System
The "R0" at the end of the part number indicates the specific attachment kit. This system uses a flexible, spring-loaded mechanism that ensures:
* **Constant Pressure:** Provides uniform contact between the heat sink and the component, optimizing heat transfer.
* **Secure Fit:** Prevents the heat sink from shifting due to vibration or shock.
#### 2. Thermal Interface Material (TIM)
This specific model usually comes pre-applied with **ATS-PPS-18**, a high-performance thermal interface material. This eliminates the need for external thermal paste and ensures the microscopic gaps between the chip and the aluminum are filled for maximum efficiency.
#### 3. Straight Fin Profile
The straight fin design is optimized for **forced-air cooling** (fans). The spacing between the fins is engineered to minimize pressure drop while maximizing surface area for heat dissipation.
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### ### Application Considerations
* **Form Factor:** The low profile (10mm height) makes it ideal for dense PCB layouts and 1U server chassis.
* **Flow Direction:** Because it uses straight fins, the airflow should ideally be directed along the length of the fins for peak performance.
* **Component Compatibility:** Best suited for chips with a footprint around 35mm x 35mm.
- ⤷
What is the difference between ducted and unducted thermal resistance?
- ⤷ Can this heat sink be used with a custom clip instead of the pushPIN?
- ⤷ Does the blue anodized finish impact the thermal performance?