The **ATS-18H-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series, commonly used for cooling BGA (Ball Grid Array) components and other integrated circuits. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Base Dimensions** | 35mm x 35mm | | **Height** | 10mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 12.48°C/W (Unducted Flow @ 200 LFM) | --- ### 2. Design and Component Breakdown #### A. Fin Geometry (Fine Pitch) The "H" in the part number indicates a specific fin pattern. This heatsink utilizes **Straight Fins**, which are optimized for airflow environments. The fine-pitch design maximizes the surface area for heat dissipation within a compact 35mm footprint. #### B. Attachment Mechanism (Push Pins) Instead of adhesive tape, this model uses a mechanical push-pin system: * **Stability:** Provides consistent pressure on the processor/chip for better thermal contact. * **Reliability:** Unlike thermal tape, mechanical fasteners do not degrade over time due to heat cycles. * **Springs:** The "R0" indicates a specific spring tension, ensuring the component isn't crushed while maintaining contact. #### C. Thermal Interface Material (TIM) The part typically comes pre-applied with a high-performance **Thermal Phase Change Material** or thermal pad on the base. This fills the microscopic air gaps between the chip and the aluminum base to improve heat transfer. --- ### 3. Application Use Cases This specific part is typically found in the following electronic environments: * **Networking Hardware:** Cooling ASICs in routers and switches. * **Embedded Systems:** Industrial PCs where vibration resistance is necessary (push pins are better for vibration than adhesive). * **Power Electronics:** Dissipating heat from high-speed transistors or FPGA chips. --- ### 4. Part Number Breakdown Key * **ATS:** Advanced Thermal Solutions (Manufacturer) * **18:** Series/Fin Height designator * **H:** High-performance fin density * **35:** Width/Length in mm * **C2:** Blue Anodized finish * **R0:** Revision/Specific spring tension code