The **ATS-18H-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the mechanical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.21°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Style** | Fine Pitch (High Density) | --- ### 2. Part Number Breakdown Understanding the nomenclature helps in identifying the specific configuration of the unit: * **ATS:** Brand (Advanced Thermal Solutions). * **18H:** Series/Product line identifier. * **40:** Dimension code (indicating the 45mm footprint size in this series). * **C2:** Material/Color code (typically signifies Blue Anodized Aluminum). * **R0:** Revision or RoHS compliance status. --- ### 3. Key Electronic Functions While the heatsink itself is a passive mechanical part, its role in an electronic circuit is critical: * **Thermal Dissipation:** It increases the surface area of the heat-generating component, allowing air to carry away heat more efficiently. * **Push-Pin Attachment:** The "pushPIN™" system provides a specific pressure (clamping force) on the electronic chip, which ensures maximum contact with the **Thermal Interface Material (TIM)**. * **Aerodynamic Design:** The fin pattern is optimized for "Cross-Flow," meaning it performs well even if the airflow direction is inconsistent within the electronic enclosure. --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs or automation controllers. * **Telecommunications:** High-speed routers and switches. * **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs). ---