The **ATS-18H-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for efficient heat dissipation from integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number encodes specific characteristics of the heat sink's physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Fin Type** | Square Fin (Straight/Cross-cut) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 10.02 °C/W @ 100 LFM (approx) | | **Surface Finish** | Blue Anodized | | **Thermal Interface Material** | T766 (Pre-applied phase change) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding components. * **Size (LxW):** 40.00 mm x 40.00 mm * **Height:** 25.00 mm * **Pitch/Hole Spacing:** 45.00 mm (diagonal spacing for mounting) --- ### 3. Key Component Features #### A. pushPIN™ Attachment Unlike adhesive tapes or simple clips, this model uses a **pushPIN™ system**. This consists of a plastic or metal pin with a compressed spring. It provides: * **Constant Pressure:** Ensures optimal contact between the heat sink and the chip. * **Vibration Resistance:** Securely holds the component in place during transport or mechanical stress. * **Ease of Assembly:** Can be installed manually or with basic tools through pre-drilled holes in the PCB. #### B. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodization:** This is not just for aesthetics; the anodized coating increases surface emissivity (helping with radiation cooling) and provides corrosion resistance. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number indicates it comes with **T766** pre-applied. This is a high-performance thermal pad/paste that fills microscopic air gaps between the heat sink and the processor, significantly lowering thermal resistance. --- ### 4. Application Use Cases This specific heat sink is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Computing:** Industrial PC processors and FPGAs. 3. **Power Electronics:** Cooling MOSFETs or power modules.