The **ATS-18H-48-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below are the primary technical characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Fin Type** | Fine Pitch (High Surface Area) | | **Dimensions** | 25mm x 25mm x 15mm | | **Thermal Resistance** | ~7.50° C/W (at 200 LFM) | | **RoHS Status** | Compliant | --- ## 2. Key Components & Design The "pushPIN™" system is the standout electronic/mechanical feature of this part: * **Heat Sink Base:** Flat aluminum surface designed to interface with the heat-generating component using Thermal Interface Material (TIM). * **Fins:** Vertical structures that increase the surface area for convective cooling. The "Fine Pitch" design is optimized for high-airflow environments. * **Compression Springs:** Provide a precise, consistent pressure (preload) against the component, which is critical for maintaining thermal conductivity. * **Plastic/Brass Push Pins:** These snap into pre-drilled holes on the PCB (Printed Circuit Board) for a secure, tool-less installation. --- ## 3. Thermal Performance Profile Performance varies based on the airflow (measured in Linear Feet per Minute - LFM). As airflow increases, the thermal resistance decreases: | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **200 LFM (1.0 m/s)** | 7.50° C/W | | **400 LFM (2.0 m/s)** | 3.90° C/W | | **600 LFM (3.0 m/s)** | 3.00° C/W | --- ## 4. Typical Applications This specific heat sink is categorized as a "small form factor" solution, typically used in: * **Embedded Systems:** Industrial PCs and controllers. * **Networking Gear:** Switches, routers, and small-scale servers. * **Power Electronics:** Voltage regulators and high-speed MOSFETs. * **Telecommunications:** 5G infrastructure modules.