## Electronic Specifications: ATS-18H-71-C2-R0 The **ATS-18H-71-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" attachment series designed for cooling electronic components such as CPUs, GPUs, and other high-power ICs. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance (Flow)** | 6.72°C/W @ 200 LFM | | **Thermal Resistance (Static)** | 1.15°C/W @ 800 LFM | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Component Features * **Push-Pin Attachment:** This model uses a plastic push-pin and spring system. This ensures a consistent pressure on the processor, improving thermal conductivity and simplifying the assembly process. * **Straight Fin Geometry:** The fins are designed in a straight pattern to maximize surface area for heat dissipation while minimizing the pressure drop across the heat sink. * **Pre-Applied TIM:** It comes with **T766** thermal interface material (thermal paste/pad) pre-applied to the base, ensuring a reliable thermal bond out of the box. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized finish provides corrosion resistance and increases surface emissivity, which slightly improves radiative heat transfer. --- ### 3. Thermal Performance Profile The efficiency of the ATS-18H-71-C2-R0 is highly dependent on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 6.72 | | 400 | 2.51 | | 600 | 1.58 | | 800 | 1.15 | --- ### 4. Application Context This specific part is typically used for **Medium-to-High power components** on Printed Circuit Boards (PCBs) where mounting holes are provided. Common applications include: * Embedded computing modules. * Network switches and routers. * Power supply components (MOSFETs/IGBTs).