The **ATS-18H-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for secure mounting on Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Mounting Style** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 1.33 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 30.0mm | | **Thermal Interface Material (TIM)** | T412 (Double-sided thermal tape) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the component's features: - **ATS-18H**: Indicates the series and the height category. - **75**: Refers to the specific fin pattern/geometry configuration. - **C3**: Represents the color and finish (Blue Anodized). - **R0**: Refers to the revision code or packaging standard. --- ### 3. Key Electronic Functions While the heat sink itself is a passive mechanical component, it serves critical functions for the electronics it protects: * **Heat Dissipation:** It increases the surface area of the component (CPU, FPGA, or Power Transistor), allowing the heat generated by electrical resistance to be transferred more efficiently to the surrounding air. * **Thermal Protection:** By maintaining a lower junction temperature, it prevents "thermal throttling" and extends the lifespan of the semiconductor. * **Mechanical Stability:** The use of **push-pins** and **springs** ensures a consistent downward pressure (clamping force). This ensures that the Thermal Interface Material (TIM) remains in perfect contact with the chip, even under vibration. --- ### 4. Application Usage This specific size (25mm x 25mm) is commonly used for: 1. **Network Switches/Routers:** Cooling small processors or ASICs. 2. **Embedded Systems:** Industrial PCs where vertical space (30mm) is available but the footprint is tight. 3. **Power Supplies:** Cooling voltage regulators or MOSFETs.