## Overview of the ATS-18H-76-C2-R0 The **ATS-18H-76-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, which is designed specifically for components requiring high thermal dissipation in constrained airflow environments. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | maxiFLOW™ | | **Base Dimensions** | 45mm x 40mm | | **Height** | 15mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 11.50°C/W (Unducted Flow @ 200 LFM) | --- ### 2. Key Components & Design Features #### A. Fin Geometry The "76" in the part number refers to a specific fin pattern. The maxiFLOW design uses a **tapered fin structure** which increases the surface area while reducing pressure drop, allowing air to flow more easily through the sink. #### B. pushPIN™ Attachment Unlike simple adhesive tapes, this model uses a **pushPIN™** system: * **Mechanism:** A spring-loaded pin that passes through pre-drilled holes in the PCB. * **Benefit:** Provides consistent pressure on the component (TIM - Thermal Interface Material), ensuring optimal heat transfer and mechanical stability during vibration. #### C. Material and Coating * **Aluminum:** Chosen for its excellent weight-to-thermal conductivity ratio. * **Blue Anodized:** The coating is not just for aesthetics; anodization increases surface emissivity and protects the aluminum from corrosion. --- ### 3. Thermal Performance Analysis The performance of the ATS-18H-76-C2-R0 varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 11.50 | | 400 (2.0 m/s) | 4.40 | | 600 (3.0 m/s) | 2.96 | | 800 (4.0 m/s) | 2.40 | --- ### 4. Applications This electronic part is typically found in: * **Telecommunications:** Cooling high-speed processors or ASICs. * **Embedded Systems:** For industrial computers where space is limited. * **Networking:** Routers and switches that require reliable passive or semi-active cooling. ---