The **ATS-18H-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 25mm x 25mm x 30mm | | **Thermal Resistance** | 2.63°C/W (at 200 LFM) | | **Flow Orientation** | Vertical / Cross-Cut (Omni-directional) | --- ### 2. Key Components & Features #### A. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a pre-applied **Thermal Interface Material**. In this specific series, it usually features **T766** (a high-performance phase-change material) which ensures maximum heat transfer between the component surface and the aluminum base. #### B. pushPIN™ Attachment Unlike adhesive tapes or clips, this heat sink uses a mechanical **pushPIN™** system. * **Pros:** Provides consistent pressure for better thermal contact. * **Hardware:** It utilizes brass or plastic pins with stainless steel springs to lock into pre-drilled holes on the PCB. #### C. Fin Design (Cross-Cut) The fins are designed in a **cross-cut** pattern. This allows for: 1. **Multi-directional airflow:** It works effectively regardless of which way the air is moving across the board. 2. **Increased Surface Area:** Maximizes the area available for heat dissipation in a small 25mm footprint. --- ### 3. Physical Dimensions (Metric) ```yaml Width: 25.00 mm Length: 25.00 mm Height: 30.00 mm Pitch: 1.27 mm (Fin spacing) ``` --- ### 4. Typical Applications This part is commonly found in industrial and high-reliability electronics where space is tight but heat density is high: * **Telecommunications:** Network switches and routers. * **Embedded Computing:** Small form factor (SFF) industrial PCs. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators.