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  • ATS-18H-82-C2-R0

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    ## Electronic Component Analysis: ATS-18H-82-C2-R0 The **ATS-18H-82-C2-R0** is a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed specifically for cooling high-power electronic components such as CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 22.86mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Airflow)** | 5.21°C/W @ 200 LFM | | **Pressure Drop** | High-efficiency fin design | --- ### 2. Key Design Features * **maxiFLOW™ Fin Geometry:** The heat sink features a unique spread-fin pattern. This design reduces pressure drop and increases the surface area, which enhances thermal performance in high-velocity airflow environments. * **pushPIN™ Attachment:** The "-R0" suffix indicates a specific attachment mechanism. It uses a flexible, spring-loaded pin system that ensures consistent pressure between the heat sink and the electronic component, optimizing heat transfer. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **ATS-51**, a high-performance thermal grease, ensuring minimal thermal resistance at the contact point. --- ### 3. Application Use Cases This component is used in electronic systems where heat dissipation is critical for longevity and stability: 1. **Networking Hardware:** Switches, routers, and high-speed hubs. 2. **Industrial PCs:** Compact embedded systems that generate significant localized heat. 3. **Power Electronics:** Voltage regulators and power modules that require active or passive cooling. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 5.21 | | **300 (1.5 m/s)** | 4.01 | | **400 (2.0 m/s)** | 3.32 | | **600 (3.0 m/s)** | 2.58 | ---
    ✨ Follow-up Questions
    • ⤷ What are the mechanical dimensions of the pushPIN holes required for this heat sink?
    • ⤷ How does the 'Blue Anodized' finish affect the emissivity and thermal performance?
    • ⤷ Is there a low-profile alternative to the ATS-18H-82-C2-R0 in the same series?