ATS-18H-84-C2-R0
AI

The **ATS-18H-84-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure.
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## Technical Specifications
The following table details the physical and thermal properties of the part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Base Part Number** | ATS-18H-84-C2-R0 |
| **Thermal Resistance (Flow)** | 9.00°C/W @ 100 LFM |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm |
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## Key Design Features
### 1. Thermal Performance
The "C2" in the part number indicates a specific thermal profile. This heat sink uses a **cross-cut fin design**, which increases surface area and allows for multi-directional airflow, making it efficient in both natural and forced convection environments.
### 2. Push-PIN Attachment
Unlike adhesive tapes that can fail over time, this part uses the ATS **pushPIN™** system:
* **Spring-loaded mechanism:** Ensures constant pressure between the heat sink and the component (TIM - Thermal Interface Material).
* **Brass/Plastic Pins:** Available with various pin lengths for different PCB thicknesses.
### 3. Material and Coating
* **Aluminum 6063:** Provides a lightweight structure with high thermal conductivity.
* **Blue Anodizing:** Protects the aluminum from corrosion and slightly improves radiant heat emission.
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## Part Number Breakdown
The suffix **R0** indicates compliance with environmental standards and specific packaging:
* **ATS:** Advanced Thermal Solutions.
* **18H:** Series identification.
* **84:** Specific fin geometry/pattern.
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** RoHS compliant (Restriction of Hazardous Substances).
- ⤷
What are the compatible PCB hole patterns for the pushPIN attachment?
- ⤷ How does the thermal resistance change at higher LFM (Linear Feet per Minute) airflows?
- ⤷ Is there a recommended Thermal Interface Material (TIM) to use with this specific heat sink?