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  • ATS-18H-84-C2-R0

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    The **ATS-18H-84-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## Technical Specifications The following table details the physical and thermal properties of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Part Number** | ATS-18H-84-C2-R0 | | **Thermal Resistance (Flow)** | 9.00°C/W @ 100 LFM | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | --- ## Key Design Features ### 1. Thermal Performance The "C2" in the part number indicates a specific thermal profile. This heat sink uses a **cross-cut fin design**, which increases surface area and allows for multi-directional airflow, making it efficient in both natural and forced convection environments. ### 2. Push-PIN Attachment Unlike adhesive tapes that can fail over time, this part uses the ATS **pushPIN™** system: * **Spring-loaded mechanism:** Ensures constant pressure between the heat sink and the component (TIM - Thermal Interface Material). * **Brass/Plastic Pins:** Available with various pin lengths for different PCB thicknesses. ### 3. Material and Coating * **Aluminum 6063:** Provides a lightweight structure with high thermal conductivity. * **Blue Anodizing:** Protects the aluminum from corrosion and slightly improves radiant heat emission. --- ## Part Number Breakdown The suffix **R0** indicates compliance with environmental standards and specific packaging: * **ATS:** Advanced Thermal Solutions. * **18H:** Series identification. * **84:** Specific fin geometry/pattern. * **C2:** Material/Finish code (Blue Anodized). * **R0:** RoHS compliant (Restriction of Hazardous Substances).
    ✨ Follow-up Questions
    • ⤷ What are the compatible PCB hole patterns for the pushPIN attachment?
    • ⤷ How does the thermal resistance change at higher LFM (Linear Feet per Minute) airflows?
    • ⤷ Is there a recommended Thermal Interface Material (TIM) to use with this specific heat sink?