The **ATS-18H-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number encodes specific dimensions and material properties. Below are the core technical details: | Attribute | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Base Dimensions** | 40.00 mm x 40.00 mm | | **Height** | 25.00 mm | | **Pitch** | Fine Pitch (Optimized for airflow) | | **Thermal Resistance** | 1.30 °C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Engineering Features #### A. The Fin Pattern The ATS-95 model features a **Fine-Pitch** design. This increases the surface area available for heat dissipation, making it highly effective in systems with forced-air cooling (fans). #### B. Attachment System (pushPIN™) Instead of adhesive tapes or permanent solder, this part uses a mechanical attachment system: * **Push-pins:** Plastic or brass pins that lock into pre-drilled holes on the PCB. * **Compression Springs:** These provide consistent pressure across the interface, ensuring maximum contact with the component being cooled. #### C. Thermal Interface Material (TIM) The "C2" in the part number refers to the **T766** thermal material. This is a high-performance phase-change or grease-like material pre-applied to the base, which fills microscopic air gaps between the heat sink and the chip. --- ### 3. Applications This specific heat sink is typically used for cooling: 1. **Processors (CPUs/GPUs):** Smaller embedded processors. 2. **FPGAs & ASICs:** High-speed logic gates that generate significant heat. 3. **Power Supplies:** Cooling voltage regulators or power transistors. 4. **Networking Hardware:** Switches and routers where airflow is managed. --- ### 4. Thermal Performance Comparison Thermal resistance indicates how well the part moves heat away (lower is better). | Air Velocity (LFM) | 100 (0.5 m/s) | 200 (1.0 m/s) | 400 (2.0 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | ~7.29 | 1.30 | 0.82 |