The **ATS-19A-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications The following table outlines the core electronic and mechanical properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Top Mount (Cross-Cut) | | **Material** | Aluminum (AL6063) | | **Thermal Resistance** | 15.20°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **Attachment Method** | Push-Pin (Steel) | | **Interface Material** | T412 (Thermal Interface Material pre-applied) | | **Finish** | Blue Anodized | --- ### 2. Key Component Details #### A. Thermal Performance This heat sink is designed for low-airflow environments. The **15.20°C/W** rating means that for every watt of power dissipated by the electronic chip, the temperature will rise by 15.20 degrees Celsius. In high-velocity airflow (e.g., 800 LFM), this resistance drops significantly to approximately **4.0°C/W**. #### B. Push-Pin Attachment Mechanism The "19A" designation refers to the specific push-pin hardware. - It uses a **compression spring** and a **plastic/metal pin** that snaps into pre-drilled holes on the Printed Circuit Board (PCB). - This ensures a secure, high-pressure contact between the heat sink and the electronic component, which is critical for efficient heat transfer. #### C. Thermal Interface Material (TIM) The part comes with **T412** pre-applied to the base. T412 is a high-performance thermal pad that fills microscopic air gaps between the chip surface and the heat sink base, reducing thermal impedance. #### D. Material and Geometry - **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. - **Cross-Cut Pattern:** This allows for "omni-directional" airflow, meaning it can dissipate heat effectively regardless of which direction the fan is blowing across the PCB. --- ### 3. Common Applications This part is typically used to cool small-form-factor electronic components such as: 1. **BGA Packages:** Microprocessors or FPGAs. 2. **Power Supplies:** MOSFETs or voltage regulators. 3. **Network Hardware:** High-speed routers and switches.