ATS-19B-01-C3-R0
AI

The **ATS-19B-01-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
### 1. Technical Specifications
The part belongs to the **pushPIN™** series, which uses a specific attachment mechanism for secure mounting.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 40mm x 40mm |
| **Height** | 6mm (Low Profile) |
| **Thermal Resistance** | 22.05° C/W (@ 100 LFM) |
| **Attachment Type** | Push-pin (Spring Loaded) |
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### 2. Key Component Features
#### A. Heat Sink Geometry
* **Square Profile:** 40mm x 40mm footprint, common for standard BGA (Ball Grid Array) packages.
* **Low Profile:** The 6mm height is ideal for tight spaces where vertical clearance is limited, such as 1U servers or slim embedded systems.
#### B. Material and Thermal Efficiency
* **Aluminum Construction:** Offers a good balance between weight, thermal conductivity, and cost.
* **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects against corrosion and slightly improves radiant heat transfer.
#### C. Mounting Mechanism (pushPIN™)
The "R0" designation refers to the specific attachment kit. It typically includes:
1. **Push-pins:** Plastic or metal pins that snap into pre-drilled holes on the PCB.
2. **Springs:** Provides consistent pressure (Force) to ensure maximum contact between the heat sink and the component, optimizing the Thermal Interface Material (TIM) performance.
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### 3. Performance Analysis
Thermal resistance is the most critical electronic characteristic of this part. As airflow increases, the resistance to heat flow decreases:
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 22.05 |
| 200 | 1.0 | 10.29 |
| 300 | 1.5 | 6.89 |
| 500 | 2.5 | 4.13 |
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### 4. Part Number Breakdown
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **19:** Series/Body style
* **B:** Material/Construction code
* **01:** Specific fin geometry/Size
* **C3:** Performance/Spring force category
* **R0:** Revision/Packaging code
- ⤷What is the recommended hole size for the push-pin mounting on the PCB?
- ⤷ How does the blue anodized finish compare to black anodized in terms of thermal performance?
- ⤷ Can this heat sink be used with a fan for active cooling?