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  • ATS-19B-01-C3-R0

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    The **ATS-19B-01-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications The part belongs to the **pushPIN™** series, which uses a specific attachment mechanism for secure mounting. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm | | **Height** | 6mm (Low Profile) | | **Thermal Resistance** | 22.05° C/W (@ 100 LFM) | | **Attachment Type** | Push-pin (Spring Loaded) | --- ### 2. Key Component Features #### A. Heat Sink Geometry * **Square Profile:** 40mm x 40mm footprint, common for standard BGA (Ball Grid Array) packages. * **Low Profile:** The 6mm height is ideal for tight spaces where vertical clearance is limited, such as 1U servers or slim embedded systems. #### B. Material and Thermal Efficiency * **Aluminum Construction:** Offers a good balance between weight, thermal conductivity, and cost. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects against corrosion and slightly improves radiant heat transfer. #### C. Mounting Mechanism (pushPIN™) The "R0" designation refers to the specific attachment kit. It typically includes: 1. **Push-pins:** Plastic or metal pins that snap into pre-drilled holes on the PCB. 2. **Springs:** Provides consistent pressure (Force) to ensure maximum contact between the heat sink and the component, optimizing the Thermal Interface Material (TIM) performance. --- ### 3. Performance Analysis Thermal resistance is the most critical electronic characteristic of this part. As airflow increases, the resistance to heat flow decreases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 22.05 | | 200 | 1.0 | 10.29 | | 300 | 1.5 | 6.89 | | 500 | 2.5 | 4.13 | --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **19:** Series/Body style * **B:** Material/Construction code * **01:** Specific fin geometry/Size * **C3:** Performance/Spring force category * **R0:** Revision/Packaging code
    ✨ Follow-up Questions
    • ⤷What is the recommended hole size for the push-pin mounting on the PCB?
    • ⤷ How does the blue anodized finish compare to black anodized in terms of thermal performance?
    • ⤷ Can this heat sink be used with a fan for active cooling?