The **ATS-19B-08-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **heat sink** designed for cooling electronic components such as CPUs, GPUs, or power transistors. Below is a detailed breakdown of its specifications and electronic application. --- ### 1. General Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 14.61°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring the part does not interfere with surrounding surface-mount components. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height (Fin Height):** 15.00 mm * **Pitch:** Fine Pitch (designed for high-density airflow) --- ### 3. Electronic Design Role As an "electronic part," this component serves as a **Passive Thermal Management** solution. 1. **Thermal Dissipation:** Its primary role is to increase the surface area of a semiconductor package. By conducting heat away from the silicon die to the aluminum fins, it prevents "Thermal Throttling" or hardware failure. 2. **Mounting System (pushPIN™):** This part uses a specialized spring-loaded push-pin mechanism. In PCB design, this requires specific hole diameters and spacing to ensure the sink is pressed against the component with the correct amount of force (PSI). 3. **TIM (Thermal Interface Material):** The "-R0" designation usually indicates the inclusion of a pre-applied **Thermal Phase Change Material** or high-performance thermal tape on the base, ensuring there are no air gaps between the chip and the metal. --- ### 4. Thermal Performance Table The efficiency of this part changes based on the airflow (velocity) within the electronic enclosure: | Air Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | | :--- | :--- | :--- | :--- | | **Unducted Flow (°C/W)** | 14.61 | 5.12 | 3.12 | | **Ducted Flow (°C/W)** | 3.75 | 2.43 | 1.93 | --- ### Summary of Nomenclature * **ATS:** Manufacturer (Advanced Thermal Solutions). * **19B:** Series/Frame size identifier. * **08:** Specific fin configuration/height code. * **C2:** Material/Thermal Interface Material code (Blue Anodized / T766). * **R0:** Packaging or Revision status.