The **ATS-19B-10-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components like CPUs, GPUs, FPGAs, and ASICs. Below is the detailed breakdown of its electronic and physical specifications. --- ### 1. Technical Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.89°C/W (at 100 LFM) | | **Mounting Type** | Push-Pin (Brass or Plastic) | | **Attachment Method** | Spring-loaded push pins | --- ### 2. Component Design & Dimensions The "pushPIN™" system is designed to provide consistent pressure on the electronic component to maximize thermal transfer. * **Height:** 25.00 mm (High profile for better surface area). * **Length/Width:** 45.00 mm x 45.00 mm. * **Fin Style:** Straight fin design optimized for airflow. * **Interface:** Often paired with a Thermal Interface Material (TIM) to bridge the gap between the heat sink and the electronic chip. --- ### 3. Electronic Performance (Thermal Data) Thermal resistance indicates how efficiently the part moves heat away from the electronics. Lower values are better at higher airflows. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.89 | | 200 (1.0 m/s) | 2.70 | | 300 (1.5 m/s) | 1.60 | | 500 (2.5 m/s) | 1.12 | --- ### 4. Part Number Breakdown The part number follows a specific nomenclature used by ATS: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions | | **19B** | Specific Series / Footprint | | **10** | Specific Fin or Height configuration | | **C2** | Thermal Performance Grade / Material | | **R0** | RoHS Compliant / Revision code | --- ### 5. Application in Electronics This part is commonly used in: * **Embedded Systems:** Cooling high-speed processors. * **Telecommunications:** Cooling network switch chips. * **Power Supplies:** Dissipating heat from power transistors. ---