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  • ATS-19B-12-C2-R0

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    The part number **ATS-19B-12-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it belongs to the *maxiFLOW™* series, designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 15.86°C/W (at 100 LFM) | | **Flow Pattern** | Directional (High performance) | | **Dimensions** | 50mm x 50mm x 15mm | --- ## 2. Key Electronic Features ### Thermal Management The primary purpose of this component is to dissipate heat away from a semiconductor. The **maxiFLOW™** design features a graduated fin pattern that reduces pressure drop and increases surface area, making it highly efficient for forced-air cooling environments. ### The pushPIN™ Attachment System Unlike simple adhesive tapes, the `R0` suffix indicates a **pushPIN™** assembly. This provides several advantages for PCB design: * **Constant Pressure:** A pre-assembled compression spring ensures consistent pressure on the component for optimal thermal transfer. * **Vibration Resistance:** Secure mechanical attachment prevents the heatsink from shifting during transport or operation. * **Reliability:** Eliminates the risk of adhesive "dry out" over long lifecycles. ### Phase Change Material (TIM) Typically, these units come with a pre-applied **Thermal Interface Material (TIM)**. This fills the microscopic air gaps between the heatsink base and the electronic chip, significantly lowering thermal impedance. --- ## 3. Part Number Breakdown Understanding the nomenclature helps in identifying specific electronic requirements: * **ATS:** Advanced Thermal Solutions (Brand). * **19:** Series designation. * **B:** Material/Construction type. * **12:** Specific fin geometry/density. * **C2:** Blue Anodized finish (Electrically non-conductive surface). * **R0:** Standard pushPIN™ attachment kit included. ---
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole patterns required for the pushPIN attachment?
    • ⤷ How does the thermal resistance change at higher airflows (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Is the blue anodized finish conductive or does it act as an insulator?