ATS-19B-12-C2-R0
AI

The part number **ATS-19B-12-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it belongs to the *maxiFLOW™* series, designed for cooling electronic components like CPUs, GPUs, or FPGAs.
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## 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 15.86°C/W (at 100 LFM) |
| **Flow Pattern** | Directional (High performance) |
| **Dimensions** | 50mm x 50mm x 15mm |
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## 2. Key Electronic Features
### Thermal Management
The primary purpose of this component is to dissipate heat away from a semiconductor. The **maxiFLOW™** design features a graduated fin pattern that reduces pressure drop and increases surface area, making it highly efficient for forced-air cooling environments.
### The pushPIN™ Attachment System
Unlike simple adhesive tapes, the `R0` suffix indicates a **pushPIN™** assembly. This provides several advantages for PCB design:
* **Constant Pressure:** A pre-assembled compression spring ensures consistent pressure on the component for optimal thermal transfer.
* **Vibration Resistance:** Secure mechanical attachment prevents the heatsink from shifting during transport or operation.
* **Reliability:** Eliminates the risk of adhesive "dry out" over long lifecycles.
### Phase Change Material (TIM)
Typically, these units come with a pre-applied **Thermal Interface Material (TIM)**. This fills the microscopic air gaps between the heatsink base and the electronic chip, significantly lowering thermal impedance.
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## 3. Part Number Breakdown
Understanding the nomenclature helps in identifying specific electronic requirements:
* **ATS:** Advanced Thermal Solutions (Brand).
* **19:** Series designation.
* **B:** Material/Construction type.
* **12:** Specific fin geometry/density.
* **C2:** Blue Anodized finish (Electrically non-conductive surface).
* **R0:** Standard pushPIN™ attachment kit included.
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- ⤷
What are the specific PCB hole patterns required for the pushPIN attachment?
- ⤷ How does the thermal resistance change at higher airflows (e.g.
- ⤷ 500 LFM)?
- ⤷ Is the blue anodized finish conductive or does it act as an insulator?