The **ATS-19B-141-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" attachment series designed for efficient cooling of semiconductors and PCBs. --- ### 1. Technical Specifications Below are the primary electronic and physical specifications for this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-19B-141-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 15.76°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 10.00mm | | **Fin Style** | Fine Pitch (Straight) | --- ### 2. Electronic Application & Function While the part itself does not contain circuitry, it is a critical "passive" electronic component used to protect active silicon. * **Heat Dissipation:** It is designed to be mounted on top of Integrated Circuits (ICs), such as CPUs, GPUs, FPGAs, or Power Transistors, to conduct heat away from the junction. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal phase-change material that ensures maximum heat transfer between the chip and the aluminum. * **Acoustic Optimization:** The fine-pitch fin design is optimized for airflow, allowing the electronic system to run quieter by reducing the fan speed required to maintain safe operating temperatures. --- ### 3. Attachment Mechanism The **"C2"** designation in the part number refers to the specific hardware used for securing the sink to the PCB: 1. **Push-Pins:** Plastic or brass pins that snap into pre-drilled holes in the PCB. 2. **Compression Springs:** Built-in springs provide a precise "force" (pressure) on the electronic component to ensure the thermal pad makes perfect contact without cracking the silicon die. --- ### 4. Thermal Performance Data Performance varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural Convection) | 15.76 | | 200 | 9.18 | | 400 | 6.51 | | 600 | 5.41 |