ATS-19B-151-C1-R0
AI

The **ATS-19B-151-C1-R0** is a high-performance electronic component specifically designed for thermal management. It is a **heat sink** manufactured by Advanced Thermal Solutions (ATS).
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## 1. Technical Specifications
This component belongs to the **maxiFLOW™** series, known for its high-efficiency fin structure.
| Property | Description |
| :--- | :--- |
| **Component Type** | Passive Heat Sink |
| **Material** | Aluminum (Black Anodized) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 3.90°C/W (at 200 LFM) |
| **Dimensions** | 35mm x 35mm x 20mm |
| **Fin Style** | straight (High Aspect Ratio) |
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## 2. Key Electronic Features
### A. pushPIN™ Attachment
Unlike adhesive tapes that can fail under high temperatures, this part uses the **pushPIN™** mechanism. This ensures:
* **Constant Pressure:** A brass or plastic pin with a stainless steel spring provides consistent force on the chip.
* **Reliability:** Better thermal interface material (TIM) performance over time.
### B. Thermal Interface Material (TIM)
The "R0" suffix indicates that the part typically comes with **pre-applied phase-change material** or high-performance thermal grease. This eliminates the need for manual application and ensures air bubbles are minimized between the component (e.g., a CPU or FPGA) and the heat sink.
### C. Thermal Performance (LFM)
Electronic heat dissipation is measured in Linear Feet per Minute (LFM) of airflow:
* **100 LFM:** 5.20°C/W
* **200 LFM:** 3.90°C/W
* **500 LFM:** 2.60°C/W
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## 3. Application Use Cases
This part is commonly found in the following electronic environments:
1. **Telecommunications:** Cooling high-speed processors in routers and switches.
2. **Embedded Systems:** Industrial PCs where space is tight but heat output is high.
3. **Power Supplies:** Managing heat for MOSFETs or voltage regulators.
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## 4. Part Number Breakdown
The part number follows a specific nomenclature:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **19B:** Product series/family.
* **151:** Dimensional code (35mm x 35mm).
* **C1:** Blue Anodized or specific material coating.
* **R0:** Thermal Interface Material / RoHS compliance status.
- ⤷
What are the mechanical mounting hole requirements for the pushPIN system?
- ⤷ How does the air flow direction affect the cooling efficiency of the maxiFLOW design?
- ⤷ Can this heat sink be used with custom thermal pads instead of the pre-applied TIM?