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  • ATS-19B-151-C1-R0

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    The **ATS-19B-151-C1-R0** is a high-performance electronic component specifically designed for thermal management. It is a **heat sink** manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications This component belongs to the **maxiFLOW™** series, known for its high-efficiency fin structure. | Property | Description | | :--- | :--- | | **Component Type** | Passive Heat Sink | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 3.90°C/W (at 200 LFM) | | **Dimensions** | 35mm x 35mm x 20mm | | **Fin Style** | straight (High Aspect Ratio) | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment Unlike adhesive tapes that can fail under high temperatures, this part uses the **pushPIN™** mechanism. This ensures: * **Constant Pressure:** A brass or plastic pin with a stainless steel spring provides consistent force on the chip. * **Reliability:** Better thermal interface material (TIM) performance over time. ### B. Thermal Interface Material (TIM) The "R0" suffix indicates that the part typically comes with **pre-applied phase-change material** or high-performance thermal grease. This eliminates the need for manual application and ensures air bubbles are minimized between the component (e.g., a CPU or FPGA) and the heat sink. ### C. Thermal Performance (LFM) Electronic heat dissipation is measured in Linear Feet per Minute (LFM) of airflow: * **100 LFM:** 5.20°C/W * **200 LFM:** 3.90°C/W * **500 LFM:** 2.60°C/W --- ## 3. Application Use Cases This part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs where space is tight but heat output is high. 3. **Power Supplies:** Managing heat for MOSFETs or voltage regulators. --- ## 4. Part Number Breakdown The part number follows a specific nomenclature: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **19B:** Product series/family. * **151:** Dimensional code (35mm x 35mm). * **C1:** Blue Anodized or specific material coating. * **R0:** Thermal Interface Material / RoHS compliance status.
    ✨ Follow-up Questions
    • ⤷ What are the mechanical mounting hole requirements for the pushPIN system?
    • ⤷ How does the air flow direction affect the cooling efficiency of the maxiFLOW design?
    • ⤷ Can this heat sink be used with custom thermal pads instead of the pre-applied TIM?