The **ATS-19B-18-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its specifications and electronic integration characteristics. --- ### 1. Technical Specifications The part belongs to the "maxiFLOW™" series, known for its high-aspect-ratio fin design which maximizes surface area for cooling. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 4.95°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 17.78mm | | **Fin Style** | Straight (maxiFLOW) | | **Interface Material** | T766 (Thermal Interface Material) | --- ### 2. Key Component Features #### A. pushPIN™ Attachment Unlike adhesive-based heatsinks, this part uses a **pushPIN™** system. This involves a brass pin and a stainless steel spring. * **Benefits:** Ensures consistent pressure on the electronic component, which improves thermal transfer and prevents the heatsink from shifting during mechanical shock or vibration. #### B. maxiFLOW™ Fin Geometry The "maxiFLOW" design is engineered to reduce air pressure drop while maximizing heat dissipation. * **Application:** Ideal for high-density PCB layouts where airflow may be restricted by surrounding components. #### C. Thermal Interface Material (TIM) The **C2** in the part number indicates it comes pre-applied with **T766 phase change material**. * **Function:** It fills the microscopic air gaps between the CPU/GPU and the heatsink base, significantly lowering the contact thermal resistance. --- ### 3. Electronic Application Use Cases This specific heatsink is typically used to cool mid-range integrated circuits (ICs) including: 1. **Processors (CPUs/MCUs):** For embedded systems requiring high reliability. 2. **FPGAs:** Especially those used in telecommunications and data processing. 3. **ASICs:** Application-specific chips that generate significant heat in a small 37mm footprint. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 6.64 | | 200 (Unducted) | 4.95 | | 400 (Unducted) | 3.51 | | 600 (Unducted) | 2.85 | ---