The **ATS-19B-183-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by Advanced Thermal Solutions (ATS). --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Heat Sink Type** | Straight Fin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 5.37 °C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring (STS) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | --- ### Key Electronic Components & Design #### 1. The Heat Sink Body The core component is made of **6063 Aluminum**. Aluminum is selected for its high thermal conductivity and lightweight properties. The "Straight Fin" design allows for efficient airflow across the surface area, dissipating heat from the component beneath it. #### 2. Thermal Interface Material (TIM) This part comes pre-applied with **T766 Phase Change Material**. * **Purpose:** It fills microscopic air gaps between the CPU/chip and the heat sink base to ensure maximum heat transfer. * **Benefit:** Reduces the overall thermal resistance of the assembly. #### 3. Push-Pin Attachment Mechanism Instead of adhesive tape or screws, this model uses a **Brass Push-Pin** system. * **Electronics Impact:** It provides a specific, consistent pressure (clamping force) onto the electronic chip. This prevents damage to sensitive silicon while ensuring the heat sink doesn't shift during vibration or shipping. #### 4. Blue Anodized Finish The surface is treated with a blue anodized coating. While primarily aesthetic, it provides: * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Electrical Insulation:** Anodizing creates a thin non-conductive layer, reducing the risk of short circuits if the sink accidentally touches nearby traces. --- ### Application in Circuit Design This part is typically used in the following electronic environments: * **Voltage Regulators:** Cooling power management modules. * **Processors/FPGAs:** Mid-range computing chips that generate moderate heat. * **High-Density Boards:** The 40mm footprint is standardized for many PCB layouts.