Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-19B-196-C2-R0

  • AI
    ## Technical Overview: ATS-19B-196-C2-R0 The **ATS-19B-196-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components such as CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS Assembly | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 18.11°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 45mm x 45mm x 10mm | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Design and Components The ATS-19B-196-C2-R0 utilizes the **pushPIN™** system, which consists of several critical sub-parts: 1. **The Heat Sink Body:** A low-profile aluminum structure with a "fine pitch" fin design. This maximizes surface area for air contact while maintaining a small vertical footprint (10mm height). 2. **Push Pins:** Made of nylon or brass, these pins secure the heat sink to the PCB through pre-drilled holes. 3. **Compression Springs:** These ensure consistent pressure between the heat sink and the component, optimizing thermal transfer. 4. **Thermal Interface Material (TIM):** It comes with **T766** pre-applied to the base. This fills microscopic air gaps between the heat sink and the chip to improve conductivity. --- ### 3. Performance Metrics Thermal performance is dependent on the airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 18.11 | | 300 (1.5 m/s) | 8.22 | | 500 (2.5 m/s) | 6.11 | | 700 (3.5 m/s) | 5.14 | --- ### 4. Implementation Notes * **Mounting:** Requires specific hole spacing on the PCB to match the pushPIN™ dimensions. * **Application:** Ideal for space-constrained environments where high-velocity airflow is present but vertical clearance is limited. * **Environmental:** The "R0" suffix typically denotes RoHS compliance, meaning the part is free from hazardous substances like lead. ---
    ✨ Follow-up Questions
    • ⤷ What are the exact dimensions for the PCB mounting holes for this heat sink?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ Is there a version of this heat sink with a higher profile for better passive cooling?