ATS-19B-196-C2-R0
AI

## Technical Overview: ATS-19B-196-C2-R0
The **ATS-19B-196-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components such as CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Key Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ HS Assembly |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 18.11°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions** | 45mm x 45mm x 10mm |
| **TIM (Thermal Interface Material)** | T766 (Pre-applied) |
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### 2. Design and Components
The ATS-19B-196-C2-R0 utilizes the **pushPIN™** system, which consists of several critical sub-parts:
1. **The Heat Sink Body:** A low-profile aluminum structure with a "fine pitch" fin design. This maximizes surface area for air contact while maintaining a small vertical footprint (10mm height).
2. **Push Pins:** Made of nylon or brass, these pins secure the heat sink to the PCB through pre-drilled holes.
3. **Compression Springs:** These ensure consistent pressure between the heat sink and the component, optimizing thermal transfer.
4. **Thermal Interface Material (TIM):** It comes with **T766** pre-applied to the base. This fills microscopic air gaps between the heat sink and the chip to improve conductivity.
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### 3. Performance Metrics
Thermal performance is dependent on the airflow (measured in Linear Feet per Minute - LFM).
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 18.11 |
| 300 (1.5 m/s) | 8.22 |
| 500 (2.5 m/s) | 6.11 |
| 700 (3.5 m/s) | 5.14 |
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### 4. Implementation Notes
* **Mounting:** Requires specific hole spacing on the PCB to match the pushPIN™ dimensions.
* **Application:** Ideal for space-constrained environments where high-velocity airflow is present but vertical clearance is limited.
* **Environmental:** The "R0" suffix typically denotes RoHS compliance, meaning the part is free from hazardous substances like lead.
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- ⤷
What are the exact dimensions for the PCB mounting holes for this heat sink?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Is there a version of this heat sink with a higher profile for better passive cooling?