The **ATS-19B-24-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Fin Style** | Straight (High-flow) | | **Dimensions (L x W x H)** | 54mm x 54mm x 15mm | | **Thermal Resistance** | 11.00°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the component's features: - **ATS-19**: Refers to the specific series of heat sink design. - **B**: Indicates the specific fin pattern or configuration. - **24**: Represents the height of the heat sink (in this case, 15mm based on the sub-series). - **C2**: Refers to the material and finish (Aluminum with Blue Anodized coating). - **R0**: Indicates the revision or specific packaging/attachment assembly. --- ### 3. Key Electronic Components Features #### A. Thermal Management The primary function is to dissipate heat from electronic packages. The "Blue Anodized" coating isn't just for aesthetics; it provides surface protection and slightly increases emissivity to aid in radiant heat transfer. #### B. Mounting System (Push Pins) Instead of using adhesive tape, this part uses a **push-pin and spring mechanism**. * **Pressure:** The spring provides a specific "Normal Force," ensuring the heat sink stays in constant contact with the chip. * **Stability:** It prevents the heat sink from shifting during vibration or mechanical shock. #### C. Thermal Interface Material (TIM) The "T766" designation means it comes with a pre-applied thermal pad or phase-change material. This eliminates the need for manual application of thermal grease, ensuring a uniform layer that fills microscopic air gaps between the component and the heat sink. --- ### 4. Ideal Applications * **BGA (Ball Grid Array) Components:** High-speed processors and chipsets. * **Power Electronics:** Voltage regulators and high-density power modules. * **Embedded Systems:** Industrial PCs and networking hardware where airflow is present.