The **ATS-19B-30-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" assembly line. Below is a breakdown of its technical specifications and electronic applications. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 13.12°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 70.00mm x 70.00mm | | **Height (Fin)** | 25.00mm | --- ## 2. Component Design & Anatomy This part is designed to dissipate heat from surface-mount devices (SMDs) or integrated circuits (ICs). Key electronic design elements include: ### A. Fin Configuration The "30" in the part number indicates a specific fin pattern. These are typically **Straight Fin** or **Cross-Cut** designs that allow for maximum surface area exposure to airflow, reducing the junction temperature of the underlying electronic component. ### B. The pushPIN™ Attachment Unlike adhesive tapes that can fail under high heat, this part uses a mechanical attachment system: * **Springs:** Provide precise vertical pressure (Pre-loaded) to ensure optimal interface between the chip and the heat sink. * **Plastic/Brass Pins:** Secure the assembly into pre-drilled holes on the Printed Circuit Board (PCB). ### C. Thermal Interface Material (TIM) The **"C2"** suffix indicates that the part comes pre-applied with a high-performance thermal interface material (usually a phase-change material or thermal grease). This fills microscopic air gaps between the component die and the aluminum base to improve heat transfer. --- ## 3. Electronic Applications This heat sink is typically used in environments where reliability and high thermal dissipation are required: * **Processors & FPGAs:** High-speed computing chips that generate significant heat. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Telecommunications:** Used in rack-mounted servers where forced air (fans) is present. * **Industrial Controls:** Protecting sensitive electronics from thermal throttling or failure. --- ## 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **19B** | Series/Base Style | | **30** | Specific Fin Design/Geometry | | **C2** | Thermal Interface Material (T766 or similar) | | **R0** | RoHS Compliant status |