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  • ATS-19B-38-C2-R0

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    The **ATS-19B-38-C2-R0** is a specific high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, designed for cooling high-power semiconductors. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Specification | Details | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | maxiFLOW™ | | **Dimensions** | 36.83mm x 36.83mm x 22.86mm (LxWxH) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | ~4.42°C/W (at 200 LFM) | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Key Electronic Features #### A. Thermal Performance The "C2" in the part number indicates the specific thermal performance grade. The heat sink features a **fluted fin design** that increases surface area and creates turbulence in the airflow, which significantly reduces the thermal resistance between the electronic component (like a CPU, FPGA, or GPU) and the ambient air. #### B. Mounting Mechanism (pushPIN™) Unlike simple adhesive tapes, this part uses a mechanical **pushPIN™** system. This is critical for electronic reliability because: * It ensures a consistent **pressure/clamping force** (measured in grams-force). * It prevents the heat sink from shifting during thermal expansion/contraction. * The pins are available in multiple materials (Plastic or Brass) to suit different PCB environments. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. In electronics, the TIM is vital for filling microscopic air gaps between the semiconductor die and the aluminum heat sink, ensuring efficient heat transfer. --- ### 3. Common Applications This specific size and thermal profile are commonly found in: * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PC modules and high-speed data processing units. * **Power Electronics:** Voltage regulators and high-current power supplies. --- ### 4. Part Number Decoder | Part Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **19B** | Specific series/design profile | | **38** | Dimension identifier (36.83mm) | | **C2** | Thermal performance/Material grade | | **R0** | Revision / RoHS Compliant status |
    ✨ Follow-up Questions
    • ⤷ What is the exact hole pattern required on a PCB for the pushPIN™ mounting of this heat sink?
    • ⤷ How does the T766 interface material compare to standard thermal grease in long-term reliability?
    • ⤷ Can this heat sink be used for passive cooling without a fan?