ATS-19B-38-C2-R0
AI

The **ATS-19B-38-C2-R0** is a specific high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, designed for cooling high-power semiconductors.
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### 1. Technical Specifications
The part number encodes specific physical and thermal characteristics. Here is the breakdown:
| Specification | Details |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Series** | maxiFLOW™ |
| **Dimensions** | 36.83mm x 36.83mm x 22.86mm (LxWxH) |
| **Material** | Aluminum (with Blue Anodized Finish) |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | ~4.42°C/W (at 200 LFM) |
| **Thermal Interface** | T766 (Pre-applied Phase Change Material) |
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### 2. Key Electronic Features
#### A. Thermal Performance
The "C2" in the part number indicates the specific thermal performance grade. The heat sink features a **fluted fin design** that increases surface area and creates turbulence in the airflow, which significantly reduces the thermal resistance between the electronic component (like a CPU, FPGA, or GPU) and the ambient air.
#### B. Mounting Mechanism (pushPIN™)
Unlike simple adhesive tapes, this part uses a mechanical **pushPIN™** system. This is critical for electronic reliability because:
* It ensures a consistent **pressure/clamping force** (measured in grams-force).
* It prevents the heat sink from shifting during thermal expansion/contraction.
* The pins are available in multiple materials (Plastic or Brass) to suit different PCB environments.
#### C. Thermal Interface Material (TIM)
The unit comes with **T766** pre-applied. In electronics, the TIM is vital for filling microscopic air gaps between the semiconductor die and the aluminum heat sink, ensuring efficient heat transfer.
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### 3. Common Applications
This specific size and thermal profile are commonly found in:
* **Networking Equipment:** Routers, switches, and base stations.
* **Embedded Systems:** Industrial PC modules and high-speed data processing units.
* **Power Electronics:** Voltage regulators and high-current power supplies.
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### 4. Part Number Decoder
| Part Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **19B** | Specific series/design profile |
| **38** | Dimension identifier (36.83mm) |
| **C2** | Thermal performance/Material grade |
| **R0** | Revision / RoHS Compliant status |
- ⤷
What is the exact hole pattern required on a PCB for the pushPIN™ mounting of this heat sink?
- ⤷ How does the T766 interface material compare to standard thermal grease in long-term reliability?
- ⤷ Can this heat sink be used for passive cooling without a fan?