Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-19B-49-C2-R0

  • AI
    The **ATS-19B-49-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is part of the "maxiFLOW" series produced by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications and electronic application. --- ### 1. General Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Family** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 2.63°C/W (at 200 LFM) | | **Flow Orientation** | Directional (High-aspect ratio fins) | --- ### 2. Physical Dimensions This component is designed for precise thermal management on Printed Circuit Boards (PCBs) where space and airflow are critical. * **Length:** 41.00 mm * **Width:** 45.00 mm * **Height:** 20.00 mm * **Fin Style:** Slanted/Tapered fins for maximum surface area and airflow efficiency. --- ### 3. Key Electronic Functions The ATS-19B-49-C2-R0 is not an active electronic component (like a transistor) but a **passive thermal management component**. Its role in an electronic system includes: 1. **Heat Dissipation:** It draws heat away from active components (CPUs, FPGAs, or MOSFETs) to prevent thermal throttling or hardware failure. 2. **Airflow Optimization:** The "maxiFLOW" design uses a graduated fin pattern that reduces pressure drop, allowing air to pass through more easily compared to standard cross-cut heat sinks. 3. **Mechanical Stability:** The `pushPIN` attachment system ensures consistent pressure between the heat sink and the electronic chip, which is vital for maintaining a reliable thermal interface. --- ### 4. Application Environments This specific model is typically found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PC modules. * **Power Electronics:** Voltage regulator modules (VRMs) that generate significant heat in a small footprint. --- ### 5. Part Number Decoding (Breakdown) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **19B** | Series/Base Type | | **49** | Size/Configuration Identifier | | **C2** | Thermal Interface Material (Blue Anodized) | | **R0** | Revision/Packaging Code |
    ✨ Follow-up Questions
    • ⤷ What type of Thermal Interface Material (TIM) is recommended for this heat sink?
    • ⤷ How do the pushPIN attachment dimensions compare to standard mounting holes?
    • ⤷ What is the maximum power dissipation (in Watts) this heat sink can handle?