The **ATS-19B-54-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components, primarily integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 35.00mm | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing)** | 1.34 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 7.00 °C/W | | **Fin Style** | Fine Pitch (Cross-Cut) | --- ### 2. Design Characteristics The part belongs to the **pushPIN™** series, which signifies a specific mounting mechanism: * **Heat Sink Material:** High-grade aluminum provides excellent thermal conductivity while remaining lightweight. * **Blue Anodized Finish:** This coating not only protects the aluminum from corrosion but also slightly increases surface emissivity, aiding in heat radiation. * **Fin Configuration:** The "Cross-Cut" pattern allows for multi-directional airflow, making it efficient even if the air isn't blowing directly straight across the fins. * **Mounting (pushPIN™):** Uses a spring-loaded pin mechanism that provides a consistent pressure (Force) against the electronic component, ensuring optimal contact with the Thermal Interface Material (TIM). --- ### 3. Nomenclature Breakdown The part number follows a specific logic used by Advanced Thermal Solutions: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **19B** | Series ID (pushPIN™ Aluminum series) | | **54** | Specific Geometry/Fin Design code | | **C2** | Thermal Performance/Material grade | | **R0** | RoHS Compliant / Revision code | --- ### 4. Application Use-Cases This heat sink is typically found in: 1. **Telecommunications:** Cooling networking chips in routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but high vertical clearance is available. 3. **Power Electronics:** Managing heat for voltage regulators or high-speed processors. ---