ATS-19B-55-C2-R0
AI

## Technical Analysis of ATS-19B-55-C2-R0
The **ATS-19B-55-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and integrated circuits (ICs).
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-19B-55-C2-R0 |
| **Attachment Method** | pushPIN™ (Plastic Pins & Springs) |
| **Heat Sink Type** | Fin-Style (Cross-Cut) |
| **Material** | Aluminum (Blue Anodized Finish) |
| **Dimensions (LxW)** | 35mm x 35mm |
| **Height** | 10mm |
| **Thermal Resistance** | 23.98 °C/W (Unducted @ 100 LFM) |
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### 2. Physical Design and Construction
The part is engineered for compact electronic environments where space is limited but heat dissipation is critical.
* **Cross-Cut Pattern:** This design allows for airflow from multiple directions, making it more effective in systems where air direction might change or is turbulent.
* **pushPIN™ Attachment:** Instead of messy thermal adhesives or complex screws, this part uses a pre-assembled plastic pin and spring mechanism. This ensures consistent pressure on the component (TIM - Thermal Interface Material) for optimal heat transfer.
* **Material:** Made from 6063 aluminum for high thermal conductivity. The **Blue Anodized** coating provides corrosion resistance and aesthetic appeal.
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### 3. Thermal Performance (Typical)
The performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 23.98 |
| 300 (1.5 m/s) | 9.02 |
| 500 (2.5 m/s) | 6.31 |
| 700 (3.5 m/s) | 5.11 |
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### 4. Implementation Details
This part is typically used for cooling:
1. **BGA Packages:** Ball Grid Arrays on Motherboards.
2. **FPGAs/CPUs:** Low-profile processors in networking or industrial gear.
3. **Power Modules:** High-heat generating voltage regulators.
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- ⤷
What are the required PCB hole sizes for the pushPIN attachment?
- ⤷ How does 'C2' in the part number relate to the thermal interface material?
- ⤷ What are the advantages of cross-cut fins over straight fins in this model?