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  • ATS-19B-55-C2-R0

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    ## Technical Analysis of ATS-19B-55-C2-R0 The **ATS-19B-55-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and integrated circuits (ICs). --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19B-55-C2-R0 | | **Attachment Method** | pushPIN™ (Plastic Pins & Springs) | | **Heat Sink Type** | Fin-Style (Cross-Cut) | | **Material** | Aluminum (Blue Anodized Finish) | | **Dimensions (LxW)** | 35mm x 35mm | | **Height** | 10mm | | **Thermal Resistance** | 23.98 °C/W (Unducted @ 100 LFM) | --- ### 2. Physical Design and Construction The part is engineered for compact electronic environments where space is limited but heat dissipation is critical. * **Cross-Cut Pattern:** This design allows for airflow from multiple directions, making it more effective in systems where air direction might change or is turbulent. * **pushPIN™ Attachment:** Instead of messy thermal adhesives or complex screws, this part uses a pre-assembled plastic pin and spring mechanism. This ensures consistent pressure on the component (TIM - Thermal Interface Material) for optimal heat transfer. * **Material:** Made from 6063 aluminum for high thermal conductivity. The **Blue Anodized** coating provides corrosion resistance and aesthetic appeal. --- ### 3. Thermal Performance (Typical) The performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 23.98 | | 300 (1.5 m/s) | 9.02 | | 500 (2.5 m/s) | 6.31 | | 700 (3.5 m/s) | 5.11 | --- ### 4. Implementation Details This part is typically used for cooling: 1. **BGA Packages:** Ball Grid Arrays on Motherboards. 2. **FPGAs/CPUs:** Low-profile processors in networking or industrial gear. 3. **Power Modules:** High-heat generating voltage regulators. ---
    ✨ Follow-up Questions
    • ⤷ What are the required PCB hole sizes for the pushPIN attachment?
    • ⤷ How does 'C2' in the part number relate to the thermal interface material?
    • ⤷ What are the advantages of cross-cut fins over straight fins in this model?