### Product Overview: ATS-19B-59-C2-R0 The **ATS-19B-59-C2-R0** is a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed specifically for thermal management in electronic circuits where space is constrained but high thermal conductivity is required. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance (Flow)** | 16.58 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.59 °C/W @ 700 LFM | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Mechanical Dimensions Precise physical dimensions are critical for PCB layout and component clearance. | Dimension | Value (mm) | | :--- | :--- | | **Width (A)** | 40.00 mm | | **Length (B)** | 40.00 mm | | **Height (C)** | 20.00 mm | | **Pitch (E)** | 45.00 mm | | **Pitch (F)** | 45.00 mm | --- ### 3. Key Electronic/Thermal Features * **Fin Design:** It utilizes a **Straight Fin** pattern. This is ideal for high-velocity airflow environments where air moves in a specific direction across the PCB. * **Thermal Interface Material (TIM):** It comes with **T766** pre-applied. This is a high-performance phase-change material that ensures there are no air gaps between the heat-generating component (CPU/GPU/FPGA) and the aluminum base. * **Attachment System:** The push-pin mechanism uses a compression spring. This provides a precise "Calculated Force" to the component, ensuring the heat sink is held firmly without cracking the delicate silicon die of the chip. * **Material Efficiency:** The use of **6063 Aluminum** provides a balance between lightweight construction and high thermal conductivity. --- ### 4. Typical Applications This specific model is generally found in: 1. **Network Switches/Routers:** Cooling high-speed processors. 2. **Embedded Systems:** Industrial PCs where vertical clearance is limited to 20mm. 3. **Power Electronics:** Cooling MOSFETs or power regulators in concentrated layouts.