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  • ATS-19B-72-C3-R0

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    The **ATS-19B-72-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-19B-72-C3-R0 | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 5.10°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Geometry (Straight Fin) The device uses a **straight-fin** pattern. In electronic cooling, this design is optimized for "undirected" airflow. The fins increase the surface area available to transfer heat from the semiconductor die to the surrounding air. #### 2. pushPIN™ Attachment Mechanism Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system. * **The Component:** A brass or plastic pin with a high-tension spring. * **The Benefit:** It provides consistent pressure (interface force) across the electronic component, which ensures the Thermal Interface Material (TIM) performs at peak efficiency. #### 3. Thermal Interface Material (TIM) The "C3" in the part number indicates the specific thermal compound used (T766). * **Function:** It fills microscopic air gaps between the heat sink base and the electronic chip. * **Conductivity:** Highly conductive to ensure heat flows out of the silicon and into the aluminum fins with minimal resistance. #### 4. Blue Anodized Finish The blue coating is not just for aesthetics. Anodization provides: * **Electrical Insulation:** It adds a non-conductive layer to the aluminum, preventing short circuits if the sink accidentally touches nearby traces. * **Corrosion Resistance:** Protects the aluminum from oxidation in harsh environments. --- ### Thermal Performance Table The efficiency of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM) generated by system fans: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.10 | | 300 (1.5 m/s) | 2.13 | | 500 (2.5 m/s) | 1.55 | | 700 (3.5 m/s) | 1.30 |
    ✨ Follow-up Questions
    • ⤷ How do I calculate if this heat sink is sufficient for a 10W chip?
    • ⤷ What is the physical hole pattern required on the PCB for this push-pin?
    • ⤷ What are the alternatives to the T766 thermal interface material?