ATS-19B-72-C3-R0
AI

The **ATS-19B-72-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-19B-72-C3-R0 |
| **Series** | pushPIN™ |
| **Attachment Type** | Push Pin |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 5.10°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 15mm |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### Key Electronic & Mechanical Components
#### 1. Heat Sink Geometry (Straight Fin)
The device uses a **straight-fin** pattern. In electronic cooling, this design is optimized for "undirected" airflow. The fins increase the surface area available to transfer heat from the semiconductor die to the surrounding air.
#### 2. pushPIN™ Attachment Mechanism
Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system.
* **The Component:** A brass or plastic pin with a high-tension spring.
* **The Benefit:** It provides consistent pressure (interface force) across the electronic component, which ensures the Thermal Interface Material (TIM) performs at peak efficiency.
#### 3. Thermal Interface Material (TIM)
The "C3" in the part number indicates the specific thermal compound used (T766).
* **Function:** It fills microscopic air gaps between the heat sink base and the electronic chip.
* **Conductivity:** Highly conductive to ensure heat flows out of the silicon and into the aluminum fins with minimal resistance.
#### 4. Blue Anodized Finish
The blue coating is not just for aesthetics. Anodization provides:
* **Electrical Insulation:** It adds a non-conductive layer to the aluminum, preventing short circuits if the sink accidentally touches nearby traces.
* **Corrosion Resistance:** Protects the aluminum from oxidation in harsh environments.
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### Thermal Performance Table
The efficiency of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM) generated by system fans:
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 5.10 |
| 300 (1.5 m/s) | 2.13 |
| 500 (2.5 m/s) | 1.55 |
| 700 (3.5 m/s) | 1.30 |
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How do I calculate if this heat sink is sufficient for a 10W chip?
- ⤷ What is the physical hole pattern required on the PCB for this push-pin?
- ⤷ What are the alternatives to the T766 thermal interface material?