The **ATS-19B-76-C3-R0** is a specific electronic component belonging to the thermal management category. It is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" line. --- ## 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Push-Pin) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 25mm x 25mm | | **Height** | 10mm | | **Pitch** | Fine Pitch | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 11.84 °C/W (at 100 LFM) | --- ## 2. Key Component Features ### Thermal Design * **Straight Fin Pattern:** Designed for high-performance cooling in environments with consistent airflow. * **Material Efficiency:** Made from extruded aluminum (6063), which provides a high thermal conductivity-to-weight ratio. ### Mechanical Attachment (pushPIN™) * **Spring-Loaded Mechanism:** Uses a brass push-pin with a stainless steel spring to provide precise pressure on the electronic component (CPU, GPU, or MOSFET). * **Ease of Assembly:** Features pre-drilled holes for a secure, tool-free installation into the PCB. ### Interface Material * **Thermal Interface Material (TIM):** These parts typically come with a pre-applied high-performance thermal pad (usually T766) to ensure maximum heat transfer between the component and the sink. --- ## 3. Part Number Breakdown The part number **ATS-19B-76-C3-R0** can be decoded as follows: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **19**: Series/Series identifier. 3. **B**: Attachment type (Push-pin). 4. **76**: Specific dimensions/fin configuration. 5. **C3**: Thermal Interface Material (TIM) code. 6. **R0**: RoHS Compliance status and revision. --- ## 4. Typical Applications This component is used to prevent thermal throttling or hardware failure in: * **Telecommunications:** Network switches and routers. * **Computing:** Miniature PC builds or embedded systems. * **Power Electronics:** Voltage regulators and high-speed memory modules.