The **ATS-19B-77-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling processors and other surface-mount components. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19B-77-C2-R0 | | **Material** | Aluminum | | **Fin Type** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 9.30°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **Thermal Interface Material (TIM)** | T766 (High Performance Phase Change) | | **Finish** | Blue Anodized | --- ### 2. Breakdown of the Component Parts #### A. The Heat Sink Body The main body is made of **Aluminum 6063**, which offers high thermal conductivity. The "Straight Fin" design is optimized for high-density airflow. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection and slightly improves radiation heat transfer. #### B. The Attachment Mechanism (Push-Pin) This model utilizes a **Push-Pin** system with a compression spring. * **Plastic Push-Pins:** These provide a secure, standardized attachment to the PCB. * **Springs:** Ensure constant, high pressure between the heat sink and the component, which is critical for minimizing thermal contact resistance. #### C. Thermal Interface Material (TIM) The code **"C2"** in the part number indicates the presence of a pre-applied **T766 thermal pad**. This is a phase-change material that melts at operating temperatures to fill microscopic air gaps between the heat sink and the chip. --- ### 3. Part Number Decoder Understanding the "Electronic DNA" of this part: | Segment | Meaning | | :--- | :--- | | **ATS-19B** | Series identifier (standard push-pin attachment) | | **77** | Size and Fin configuration code | | **C2** | Thermal Interface Material type (T766) | | **R0** | Standard RoHS compliant revision | --- ### 4. Implementation Considerations * **PCB Hole Pattern:** This part requires pre-drilled holes in the PCB to accommodate the push-pins. * **Airflow:** Being a straight-fin design, it is most effective in systems with a defined linear airflow path (forced convection). * **Clearance:** Ensure the 20mm height does not interfere with neighboring components or the device chassis.