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  • ATS-19B-80-C3-R0

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    The **ATS-19B-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to dissipate heat from surface-mount components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Brass pins / Steel springs) | | **Dimensions** | 36.83mm x 36.83mm x 25.00mm | | **Thermal Resistance** | 3.75°C/W (at 200 LFM) | | **Airflow Design** | High-performance flared fin | --- ### 2. Key Electronic Features * **Thermal Management:** It is designed to transfer heat away from high-power electronic components to prevent thermal throttling or hardware failure. * **pushPIN™ Attachment:** This system provides a specific pressure (Pre-assembled with springs) to ensure optimal contact between the heat sink and the component, maximizing thermal interface material (TIM) performance. * **Aerodynamic Fin Design:** The flared fin pattern (maxiFLOW) increases surface area and improves airflow efficiency, making it ideal for systems with high-velocity air cooling. * **EMI Shielding Consideration:** While primarily thermal, its aluminum construction can influence the electromagnetic profile of the PCB area it covers. --- ### 3. Application Use Cases This specific model is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed network processors. 2. **Industrial Computing:** Maintaining temperatures in embedded PC systems. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulator modules (VRMs). --- ### 4. Component Diagram (Simplified) ```text [ Flared Fins ] <-- Increases surface area ___________________ | | | Base Plate | <-- 36.83mm x 36.83mm |___________________| | | [Spring] [Spring] <-- pushPIN™ mechanisms | | ```
    ✨ Follow-up Questions
    • ⤷ What is the significance of the C3-R0 suffix in the part number?
    • ⤷ How do I calculate if this heat sink is sufficient for a 15W TDP processor?
    • ⤷ What type of Thermal Interface Material (TIM) is recommended for this model?