ATS-19B-80-C3-R0
AI

The **ATS-19B-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to dissipate heat from surface-mount components like CPUs, GPUs, and FPGAs.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ (Brass pins / Steel springs) |
| **Dimensions** | 36.83mm x 36.83mm x 25.00mm |
| **Thermal Resistance** | 3.75°C/W (at 200 LFM) |
| **Airflow Design** | High-performance flared fin |
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### 2. Key Electronic Features
* **Thermal Management:** It is designed to transfer heat away from high-power electronic components to prevent thermal throttling or hardware failure.
* **pushPIN™ Attachment:** This system provides a specific pressure (Pre-assembled with springs) to ensure optimal contact between the heat sink and the component, maximizing thermal interface material (TIM) performance.
* **Aerodynamic Fin Design:** The flared fin pattern (maxiFLOW) increases surface area and improves airflow efficiency, making it ideal for systems with high-velocity air cooling.
* **EMI Shielding Consideration:** While primarily thermal, its aluminum construction can influence the electromagnetic profile of the PCB area it covers.
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### 3. Application Use Cases
This specific model is typically found in the following electronic environments:
1. **Telecommunications:** Cooling of high-speed network processors.
2. **Industrial Computing:** Maintaining temperatures in embedded PC systems.
3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulator modules (VRMs).
---
### 4. Component Diagram (Simplified)
```text
[ Flared Fins ] <-- Increases surface area
___________________
| |
| Base Plate | <-- 36.83mm x 36.83mm
|___________________|
| |
[Spring] [Spring] <-- pushPIN™ mechanisms
| |
```
- ⤷
What is the significance of the C3-R0 suffix in the part number?
- ⤷ How do I calculate if this heat sink is sufficient for a 15W TDP processor?
- ⤷ What type of Thermal Interface Material (TIM) is recommended for this model?