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  • ATS-19B-84-C2-R0

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    ## ATS-19B-84-C2-R0: Technical Overview The **ATS-19B-84-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed as a passive cooling component for electronic integrated circuits (ICs), such as CPUs, GPUs, or FPGAs. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 8.96° C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 35.00mm | | **Fin Style** | Straight Fin | --- ### 2. Electronic Component Characteristics While a heat sink is a mechanical part, its "electronic" relevance pertains to how it interacts with the PCB and the semiconductor it protects: #### A. Thermal Management (Heat Dissipation) The primary role of this part is to manage the **Thermal Design Power (TDP)** of an electronic component. It transfers heat from the silicon die to the ambient air. The "C2" in the part number indicates the use of **T766 thermal interface material (TIM)**, which is pre-applied to ensure maximum thermal conductivity between the chip and the aluminum. #### B. The pushPIN™ Mounting System To protect sensitive PCB traces and electronic components, this unit uses a specific mounting mechanism: * **Compression Springs:** These provide precise pressure to ensure the heat sink remains in contact with the electronic part without cracking the substrate. * **Attachment:** Designed for pre-drilled holes in the PCB, preventing shifting during vibration or thermal expansion. #### C. Airflow Efficiency The straight-fin design is optimized for **forced air cooling** (fans). In high-density electronic enclosures, the fin spacing is calculated to reduce pressure drop while maximizing the surface area exposed to the airflow. --- ### 3. Applications in Electronics * **Telecommunications:** Used on high-speed networking chips. * **Embedded Systems:** Ideal for industrial controllers where space is limited but vertical height (35mm) is available. * **Power Supplies:** Cooling voltage regulators or power transistors.
    ✨ Follow-up Questions
    • ⤷ What is the difference between Blue Anodized and other finishes in terms of thermal performance?
    • ⤷ How do I calculate if the 8.96 C/W thermal resistance is sufficient for my specific CPU?
    • ⤷ Are there alternative mounting options if my PCB does not have push-pin holes?