The **ATS-19B-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like BGA (Ball Grid Array) packages. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm | | **Height** | 10.00mm | | **Attachment Method** | pushPIN™ (Brass pins/Plastic pins) | | **Thermal Resistance** | 22.98°C/W (Unducted Flow @ 200 LFM) | | **Pressure Drop** | 0.15 in-H2O (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied phase change material) | --- ### 2. Key Features * **maxiFLOW™ Design:** Features a flared fin structure that increases the surface area for maximum heat dissipation in high-velocity airflow environments. * **pushPIN™ Attachment:** Utilizes a spring-loaded mechanism that ensures even pressure across the component, improving thermal contact and preventing damage to the PCB. * **Pre-Applied TIM:** Comes with a Thermal Interface Material (T766) already applied to the base, simplifying the assembly process and ensuring consistent performance. * **Blue Anodization:** Provides a protective oxide layer that increases durability and corrosion resistance. --- ### 3. Application Use-Cases This specific heat sink is typically used in space-constrained electronic systems where active cooling (fans) or high-speed ducted airflow is present: * **Networking Equipment:** Routers, switches, and base stations. * **Computing:** High-performance processors and chipsets. * **Embedded Systems:** Industrial controllers and automation hardware. * **Telecommunications:** Signal processing units. --- ### 4. Thermal Performance Comparison (Airflow) The efficiency of the ATS-19B-85-C2-R0 is highly dependent on the velocity of the air passing through the fins: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 22.98 | | 400 | 11.45 | | 600 | 8.12 | | 800 | 6.45 |