The **ATS-19B-93-C2-R0** is a high-performance thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink** from the *maxiFLOW™* series. Unlike active electronic parts (like ICs), this is a passive mechanical component essential for the thermal stability of electronic systems. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Here are the core specifications: | Feature | Specification | | :--- | :--- | | **Material** | Blue Anodized Aluminum | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing)** | 1.19 °C/W @ 200 LFM | | **Thermal Resistance (Static)** | 5.69 °C/W | | **Dimensions** | 40mm x 40mm | | **Height** | 12.7mm | | **Fin Style** | Straight (maxiFLOW™) | --- ## 2. Key Component Breakdown ### A. maxiFLOW™ Fin Design The "93" in the part number refers to the specific fin geometry. The maxiFLOW™ design features a tapered fin structure which: * Reduces pressure drop. * Increases the surface area available for convection. * Is optimized for high-performance cooling in constrained spaces. ### B. pushPIN™ Attachment System This component uses a specialized mounting mechanism: * **Hardware:** It typically includes brass or plastic pins and a compression spring. * **PCB Interface:** It requires pre-drilled holes in the PCB. * **Benefit:** Provides consistent pressure on the processor/chip, ensuring optimal contact with the Thermal Interface Material (TIM). ### C. C2-R0 (Material & Finish) * **C2:** Refers to the thermal performance grade and often indicates the use of a specific Thermal Interface Material (TIM) pre-applied to the base. * **R0:** Indicates compliance with RoHS (Restriction of Hazardous Substances) standards. --- ## 3. Electronic Application This heat sink is typically used to cool the following types of electronic components: 1. **ASICs & FPGAs:** High-gate-count chips that generate significant localized heat. 2. **Processors:** Embedded CPUs or GPUs in industrial computing. 3. **Power Electronics:** Large MOSFET arrays or power modules. ### Thermal Performance Table (Airflow Impact) | Air Velocity (LFM) | 200 | 400 | 600 | 800 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 1.19 | 0.82 | 0.69 | 0.62 | ---