The **ATS-19B-97-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like BGA (Ball Grid Array) chips, CPUs, or GPUs. --- ## 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (Body), Copper (Optional Base) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | Approx. 20.30 °C/W (Unducted Flow) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | --- ## 2. Component Breakdown ### A. Material and Design The unit is constructed from high-grade aluminum. It utilizes a **straight-fin** design which is optimized for airflow directed across the board. The low-profile height (10mm) makes it suitable for compact electronic enclosures where vertical space is limited. ### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the "pushPIN™" system provides a mechanical connection to the PCB: * **Spring-loaded:** Ensures constant pressure between the heat sink and the chip. * **Reliability:** Prevents the heat sink from shifting during vibration or shipping. * **Hole Pattern:** Requires pre-drilled holes in the PCB for installation. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. This is a phase-change material or high-performance thermal grease that fills the microscopic air gaps between the component surface and the heat sink base to maximize heat transfer. --- ## 3. Part Number Decoding (ATS-19B-97-C2-R0) | Segment | Meaning | | :--- | :--- | | **ATS-19** | Series identification (pushPIN™ Heat Sink) | | **B** | Standard aluminum construction | | **97** | Specific dimension/fin configuration code | | **C2** | Thermal Interface Material (T766) and color | | **R0** | RoHS compliance and revision status | --- ### Use Cases * **Networking Hardware:** Routers, switches, and modems. * **Industrial PCs:** Compact motherboards requiring active or passive cooling. * **Power Supplies:** Cooling voltage regulators or power transistors.