The **ATS-19D-06-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed for cooling integrated circuits (ICs) and other electronic surface-mount components. --- ## 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pegs / Springs) | | **Thermal Resistance** | 20.17 °C/W (Unducted @ 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Fin Configuration** | Fine Pitch / Cross-Cut | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ## 2. Key Components & Construction The "electronic" functionality of this part is passive, meaning it does not consume electricity but is critical for the thermal management of active electronics. ### A. The Heat Sink Body * **Design:** It features a square footprint (40mm) with a low profile (10mm height). This makes it suitable for tight spaces or 1U/2U server chassis. * **Fin Style:** The part uses a **Cross-Cut** pattern. This allows airflow from multiple directions, which is ideal if the internal cooling fans in a device are not perfectly aligned with the chip. ### B. Attachment Mechanism (pushPIN™) The "19D" in the part number signifies the specific attachment hardware: * **Springs:** Provides consistent pressure (preload) to ensure maximum contact between the chip and the heat sink. * **Pins:** Usually made of plastic or brass, these snap into pre-drilled holes on the Printed Circuit Board (PCB). ### C. Thermal Interface Material (TIM) The **-C2** suffix indicates that the part comes pre-assembled with **T766 thermal grease**. This is the layer that sits between the CPU/GPU and the aluminum, filling microscopic air gaps to facilitate heat transfer. --- ## 3. Application Use Cases This part is commonly found in: * **Network Switches/Routers:** Cooling processors or ASICs. * **Embedded Systems:** For industrial computers where airflow might be restricted. * **Power Supplies:** To dissipate heat from MOSFETs or voltage regulators. --- ## 4. Part Number Breakdown Understanding the nomenclature helps identify the variant: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **19:** Series/Attachment type (pushPIN™). * **D:** Spring Type/Hardware. * **06:** Dimension reference. * **C2:** Thermal Interface Material (T766). * **R0:** RoHS Compliance/Revision status.