The **ATS-19D-142-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-19D-142-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Thermal Resistance** | 4.85°C/W @ 200 LFM (Linear Feet per Minute) | | **Fin Type** | Fine Pitch (Straight Fin) | --- ## 2. Component Breakdown ### A. The Heat Sink Body The main body is made of **Aluminum**, chosen for its excellent thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just for aesthetics; it provides a protective layer against corrosion and slightly improves surface emissivity for better radiation heat transfer. ### B. pushPIN™ Attachment System This part features the ATS proprietary **pushPIN™** system. Instead of using messy adhesives or simple clips, it uses: * **Flexible Springs:** Ensure precise pressure (Force) is applied to the component, optimizing the thermal interface. * **Plastic/Brass Push Pins:** Secure the heat sink through pre-drilled holes in the PCB. ### C. Thermal Interface Material (TIM) The "C2" in the part number typically indicates that the heat sink comes pre-applied with a high-performance **T766 Thermal Phase Change Material**. This fills the microscopic air gaps between the component and the heat sink to ensure maximum heat flow. --- ## 3. Decoding the Part Number The part number follows a specific nomenclature used by ATS: | Segment | Meaning | | :--- | :--- | | **ATS-19** | Series Identification (pushPIN™ series) | | **D** | Material/Attachment variable | | **142** | Specific dimension/fin configuration code | | **C2** | Thermal Interface Material type (T766) | | **R0** | Revision code | --- ## 4. Typical Applications Because of its small footprint (25mm x 25mm), this heat sink is commonly used for: * **Southbridge/Northbridge** chipsets on motherboards. * **FPGA** (Field Programmable Gate Arrays) in industrial controllers. * **Network Switches** and high-speed routers. * **Power LED** cooling modules.