The **ATS-19D-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient heat dissipation from integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | Part of the pushPIN™ series | | **Material** | Aluminum | Blue Anodized finish for protection | | **Dimensions** | 35mm x 35mm x 20mm | Height is 20mm (Low profile) | | **Fin Type** | Cross-Cut | Provides multi-directional airflow | | **Attachment Type** | pushPIN™ | Spring-loaded pin mechanism | | **Thermal Resistance** | 17.42°C/W (Unducted) | Varies based on airflow (LFM) | --- ### 2. Design and Construction The part is engineered for precision cooling in dense electronic environments. Its design features include: * **Heat Sink Material:** Extruded aluminum (AL6063) which offers high thermal conductivity while remaining lightweight. * **Surface Treatment:** **Blue Anodized**. This layer prevents corrosion and increases the emissivity of the surface, slightly improving radiant cooling. * **Fin Pattern:** The "Cross-Cut" pattern allows air to move through the fins from multiple directions, making it ideal for systems where the airflow direction might be obstructed or variable. --- ### 3. Attachment Mechanism (pushPIN™) One of the defining "electronic parts" of this assembly is the attachment hardware. Unlike adhesive-based heat sinks, the ATS-19D-33-C2-R0 uses a mechanical system: 1. **Push Pins:** Made of durable plastic or brass, designed to snap into pre-drilled holes on the PCB (Printed Circuit Board). 2. **Compression Springs:** These provide a precise **Force-to-Component** ratio. This ensures the heat sink maintains constant pressure against the chip without cracking the silicon or the solder joints. 3. **TIM (Thermal Interface Material):** Usually comes with a pre-applied phase-change material or thermal grease on the base to bridge the microscopic air gaps between the heat sink and the electronic component. --- ### 4. Thermal Performance Data Thermal performance is measured in °C/W (Celsius per Watt), indicating how much the temperature rises for every watt of power dissipated. | Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | | :--- | :--- | :--- | :--- | | **Unducted Flow** | 17.42 | 4.10 | 2.28 | | **Ducted Flow** | 2.65 | 1.63 | 1.32 | --- ### 5. Common Applications * **Embedded Systems:** Cooling CPUs or GPUs on small form-factor boards. * **Telecommunications:** Transceiver modules and network switches. * **Power Electronics:** Cooling MOSFETs or voltage regulators.