ATS-19D-35-C2-R0
AI

The **ATS-19D-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is designed for cooling electronic components like CPUs, GPUs, or high-power semiconductors.
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### 1. Technical Specifications
The part number provides specific details about its physical and thermal properties:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 35mm x 35mm x 10mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 22.48°C/W (Natural Convection) |
| **Compatibility** | R0 (RoHS Compliant) |
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### 2. Key Electronic Functions
While this part does not have circuitry, its role in an electronic system is critical for stability and longevity:
* **Heat Dissipation:** It increases the surface area of the heat source, allowing air to carry away heat generated by electrical resistance within a chip.
* **Thermal Protection:** It prevents "Thermal Throttling" (where a processor slows down to stay cool) and avoids permanent hardware failure due to overheating.
* **pushPIN™ Technology:** This specific model uses a precision-engineered spring and pin system. This ensures even pressure across the electronic chip, which optimizes the thermal interface and prevents mechanical stress on the PCB.
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### 3. Component Breakdown
1. **The Base:** Flat aluminum surface that makes contact with the electronic component (usually via Thermal Interface Material / TIM).
2. **The Fins:** Vertical structures that increase the convective cooling area.
3. **Spring-Loaded Pins:** These replace adhesive tapes, providing a more secure and vibration-resistant mechanical connection to the motherboard or PCB.
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### 4. Typical Applications
* **Embedded Systems:** Industrial PCs and controllers.
* **Networking:** Routers, switches, and high-speed modems.
* **Power Electronics:** Voltage regulators and power transistors that generate significant heat.
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What is the difference between active and passive cooling for this heat sink?
- ⤷ How does 'Thermal Resistance' impact the cooling efficiency of the ATS-19D-35-C2-R0?
- ⤷ What type of Thermal Interface Material is recommended for this specific model?