ATS-19D-72-C2-R0
AI

The **ATS-19D-72-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for mounting onto Printed Circuit Boards (PCBs).
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## 🛠 Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-19D-72-C2-R0 |
| **Material** | Aluminum |
| **Fin Type** | Straight Fin |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 5.11°C/W (at 100 LFM) |
| **Thermal Interface Material** | T766 (Pre-applied) |
| **Finish** | Blue Anodized |
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## 🧩 Key Components and Design
### 1. The Heat Sink Body
The body is constructed from high-quality aluminum to provide excellent thermal conductivity. The "Straight Fin" design allows for efficient airflow, making it ideal for systems with directed air movement.
### 2. pushPIN™ Attachment System
This part uses a specific mechanical attachment system rather than adhesive:
* **Push Pins:** Made of nylon or brass, these go through pre-drilled holes in the PCB.
* **Springs:** Provides consistent pressure (compression) on the electronic component (CPU/GPU/FPGA) to ensure maximum heat transfer.
### 3. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the base. This is a phase-change or high-performance grease that fills microscopic air gaps between the chip and the heat sink.
### 4. Dimensions
* **Height:** 25.00mm
* **Width/Length:** 45.00mm x 45.00mm
* **Pitch:** Specific to the 72-series fin spacing for optimized air pressure drop.
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## 🔌 Applications in Electronics
This component is typically found in:
* **Network Switches/Routers:** Cooling high-speed processing chips.
* **Industrial Power Supplies:** Dissipating heat from MOSFETs or IGBTs.
* **Embedded Computing:** Protecting SoCs (System on Chips) from thermal throttling.
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## 💻 Integration Data (Mechanical)
If you are integrating this into a CAD or PCB design tool, the following mounting hole pattern is standard for this series:
```text
Hole Pattern: 38.00mm x 38.00mm (Square)
Pin Diameter: 3.0mm typical
```
- ⤷
What is the difference between T766 and other thermal interface materials?
- ⤷ How do I calculate if the 5.11°C/W resistance is sufficient for my chip?
- ⤷ Are there custom push-pin lengths available for thicker PCBs?