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  • ATS-19D-79-C2-R0

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    The **ATS-19D-79-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "blue ice" or high-performance push-pin series. Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. General Specifications This part is designed to provide thermal management for integrated circuits (ICs) such as CPUs, GPUs, and other high-heat surface-mount devices. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19D-79-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | --- ### 2. Physical Dimensions Precision in dimensions is critical for ensuring the part fits within the PCB layout without interfering with surrounding components. * **Length:** 25.00 mm * **Width:** 25.00 mm * **Height (Fin Depth):** 30.00 mm * **Fin Style:** Straight Fin * **Pitch/Pattern:** Square --- ### 3. Thermal Performance Thermal resistance measures how effectively the heat sink transfers heat away from the component into the ambient air. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 2.63 | | **400 (2.0 m/s)** | 1.99 | | **600 (3.0 m/s)** | 1.72 | --- ### 4. Technical Features * **Pre-Applied Thermal Interface Material (TIM):** This specific model typically comes with **T766** phase-change material or similar, which maximizes heat transfer between the chip surface and the aluminum base. * **Push-Pin Mounting:** The "19D" designation indicates a specific hole pattern and push-pin assembly. This provides consistent pressure for thermal contact and simplifies assembly on the production line. * **Directional Airflow:** Because it uses a straight-fin design, it is most effective when the airflow is aligned parallel to the fins. --- ### 5. Application Use Cases This component is commonly found in: 1. **Telecommunications:** Network switches and routers. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Supplies:** Cooling voltage regulators or MOSFETs.
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required for this specific push-pin mounting?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ Are there low-profile versions of the ATS-79 series available?