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  • ATS-19D-80-C2-R0

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    The **ATS-19D-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and features. --- ### 1. Technical Specifications This part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-19D-80-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 3.69°C/W (at 100 LFM) | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height (Fin Depth)** | 25.00mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Construction * **Fin Style:** It utilizes a **Fine Pitch** design. This increases the surface area available for heat dissipation within a compact footprint. * **Push-Pin Attachment:** Instead of messy adhesives or fragile clips, it uses a mechanical push-pin system. This ensures consistent pressure (clamping force) on the chip, which improves heat transfer. * **Material:** Made from lightweight aluminum with high thermal conductivity. The blue anodized finish provides corrosion resistance and aesthetic appeal. ### 3. Thermal Performance (Airflow) Thermal resistance varies based on the velocity of air (measured in Linear Feet per Minute - LFM) passing through the fins: | Air Velocity | 100 LFM | 200 LFM | 300 LFM | 400 LFM | 500 LFM | | :--- | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 3.69 | 2.11 | 1.69 | 1.48 | 1.34 | --- ### 4. Key Applications This component is typically found in: 1. **Telecommunications:** Cooling networking chips and processors. 2. **Embedded Systems:** For industrial PCs where space is limited but heat density is high. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. 4. **Consumer Electronics:** High-end audio or visual processing units. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between T766 and other thermal interface materials?
    • ⤷ How do I calculate the correct pitch for my PCB holes to fit this heatsink?
    • ⤷ Can this heatsink be used in passive cooling environments without a fan?