ATS-19D-80-C2-R0
AI

The **ATS-19D-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components.
Below is a detailed breakdown of its specifications and features.
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### 1. Technical Specifications
This part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS).
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Part Number** | ATS-19D-80-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 3.69°C/W (at 100 LFM) |
| **Dimensions (L x W)** | 30.00mm x 30.00mm |
| **Height (Fin Depth)** | 25.00mm |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Design and Construction
* **Fin Style:** It utilizes a **Fine Pitch** design. This increases the surface area available for heat dissipation within a compact footprint.
* **Push-Pin Attachment:** Instead of messy adhesives or fragile clips, it uses a mechanical push-pin system. This ensures consistent pressure (clamping force) on the chip, which improves heat transfer.
* **Material:** Made from lightweight aluminum with high thermal conductivity. The blue anodized finish provides corrosion resistance and aesthetic appeal.
### 3. Thermal Performance (Airflow)
Thermal resistance varies based on the velocity of air (measured in Linear Feet per Minute - LFM) passing through the fins:
| Air Velocity | 100 LFM | 200 LFM | 300 LFM | 400 LFM | 500 LFM |
| :--- | :--- | :--- | :--- | :--- | :--- |
| **Resistance (°C/W)** | 3.69 | 2.11 | 1.69 | 1.48 | 1.34 |
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### 4. Key Applications
This component is typically found in:
1. **Telecommunications:** Cooling networking chips and processors.
2. **Embedded Systems:** For industrial PCs where space is limited but heat density is high.
3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.
4. **Consumer Electronics:** High-end audio or visual processing units.
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- ⤷
What is the difference between T766 and other thermal interface materials?
- ⤷ How do I calculate the correct pitch for my PCB holes to fit this heatsink?
- ⤷ Can this heatsink be used in passive cooling environments without a fan?