The **ATS-19D-87-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure their operational stability. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Parameter | Specification | Details | | :--- | :--- | :--- | | **Type** | pushPIN™ Heat Sink | Features a spring-loaded attachment system | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and provides corrosion resistance | | **Dimensions** | 35mm x 35mm x 20mm | (L x W x H) | | **Fin Pattern** | Straight | Designed for consistent airflow | | **Attachment** | Push-Pin | Secure mechanical mounting without adhesives | | **Thermal Interface** | T766 | Pre-applied thermal interface material (TIM) | --- ### 2. Physical Design Elements #### A. The Fin Profile The "87" in the series typically refers to a specific fin density. This model uses a **straight-fin** design, which is optimized for systems where there is a clear, directional airflow (forced convection). #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the **ATS-19D-87-C2-R0** uses a "push-pin" system. This consists of: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Provide constant pressure (load) on the component, ensuring the thermal interface material fills all microscopic gaps. #### C. Thermal Interface Material (T766) The bottom of the heat sink comes pre-applied with **T766**, a high-performance phase-change material. This eliminates the need for manual thermal paste application and ensures a low thermal resistance path from the chip to the aluminum fins. --- ### 3. Thermal Performance Thermal resistance is measured in °C/W (Degrees Celsius per Watt). For this specific model: * **Unducted Flow:** Higher resistance; relies on ambient air movement. * **Ducted Flow:** Lower resistance; performs significantly better when air is channeled directly through the fins. * **Thermal Resistance (at 100 LFM):** Typically around **4.67 °C/W** (varies based on specific airflow conditions). --- ### 4. Applications This part is commonly found in: * **Networking Hardware:** Routers, switches, and base stations. * **Industrial PCs:** Compact systems requiring robust mechanical mounting. * **Power Supplies:** Cooling voltage regulators and MOSFETs. ---