The **ATS-19E-01-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table breaks down the core physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Part Number** | ATS-19E-01-C2-R0 | | **Heat Sink Type** | Push-pin Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 6mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | | **Number of Fins** | Fine Pitch (Rectangular) | --- ### 2. Component Breakdown #### A. The Heat Sink Body The body is made of **Aluminum 6063**, which offers a balance between thermal conductivity and structural integrity. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and increases emissivity for better radiative heat transfer. #### B. The Attachment System (Push-Pins) The "R0" designation refers to the specific attachment kit. * **Mechanism:** It uses a spring-loaded push-pin system. * **Reliability:** Unlike adhesive tapes, push-pins provide a consistent downward pressure (clamping force), which ensures a more stable thermal connection over the life of the product. * **Springs:** The springs are designed to maintain a specific "Pre-load" to prevent the heat sink from shifting during vibration or shock. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. This is a phase-change or high-conductivity material that fills the microscopic air gaps between the electronic chip and the bottom of the heat sink, significantly reducing thermal resistance. --- ### 3. Thermal Performance Profile The effectiveness of the ATS-19E-01-C2-R0 depends heavily on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: * **Unducted Flow:** At low airflow (200 LFM), the thermal resistance is roughly **21.90 °C/W**. * **Ducted Flow:** Performance improves significantly as airflow increases, dropping to approximately **12.00 °C/W** at 600 LFM. --- ### 4. Integration Logic (CAD/PCB Design) When integrating this part into a PCB design, engineers must account for the hole pattern required for the push-pins: ```text Hole Diameter: 3.175mm (approx) Hole Spacing: Matches the diagonal/square layout of the heat sink base Keep-out Zone: Ensure no surface-mount components (SMD) are placed under the pin-flanges. ```