ATS-19E-75-C3-R0
AI

The **ATS-19E-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure attachment to printed circuit boards (PCBs).
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Type** | Push-Pin (Plastic) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 15.02 °C/W (at 100 LFM) |
| **Thermal Interface Material (TIM)** | T412 (High Performance) |
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### 2. Component Breakdown
#### A. The Heat Sink Body
The unit is a low-profile **Straight Fin** heat sink. Straight fins are optimized for unidirectional airflow (forced convection), allowing air to flow through the channels to dissipate heat from the baseplate. The blue anodized coating prevents corrosion and improves emissivity.
#### B. The Attachment Mechanism (Push-Pin)
Unlike adhesive-based heat sinks, the "75" in the part number indicates a specific push-pin and spring configuration:
* **Push-Pins:** These provide a secure, mechanical connection to the PCB.
* **Springs:** These ensure constant downward pressure on the electronic component (CPU, GPU, or ASIC), which is critical for maintaining thermal contact.
#### C. Thermal Interface Material (TIM)
The **C3** designation indicates that it comes pre-applied with **T412**, a high-quality thermal tape/pad. This eliminates the need for manual application of thermal paste and ensures a consistent thermal bridge between the component and the aluminum fins.
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### 3. Part Number Decoder
The part number follows a specific nomenclature used by Advanced Thermal Solutions:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **19E** | Series (Push-Pin style heat sink) |
| **75** | Specific Pin/Spring configuration |
| **C3** | Thermal Interface Material (T412) |
| **R0** | Revision code |
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### 4. Typical Applications
* **Networking Hardware:** Routers, switches, and high-speed modems.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Power Electronics:** Voltage regulators and power supplies where vertical space is limited (10mm height).
- ⤷
What are the airflow requirements to reach the 15.02 °C/W thermal resistance?
- ⤷ How do I determine if the hole pattern on my PCB is compatible with this push-pin design?
- ⤷ Is there a version of this heat sink with a higher profile for better cooling?