The **ATS-19E-91-C2-R0** is a high-performance thermal management component specifically categorized as an **Advanced Thermal Solutions (ATS) Heat Sink**. It belongs to the *pushPIN™* series, designed for cooling electronic components like CPUs, GPUs, or power modules. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Base Dimensions** | 40mm x 40mm | | **Height** | 10mm (Low profile) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 21.97 °C/W (Unducted @ 100 LFM) | | **Compliance** | RoHS-6 and REACH compliant | --- ### 2. Key Component Features #### A. Attachment System (pushPIN™) Unlike simple adhesive heat sinks, this part uses a mechanical fastening system consisting of: * **Brass Push Pins:** Designed to fit into pre-drilled holes on the PCB. * **Compression Springs:** These provide a precise, calculated amount of pressure (Force) to ensure maximum contact between the heat sink base and the electronic chip. #### B. Fin Design and Airflow The "Straight Fin" geometry is optimized for vertical or horizontal airflow. * **High Efficiency:** The design maximizes surface area while maintaining a low profile. * **Performance:** At higher airflows (e.g., 700 LFM), the thermal resistance drops significantly to approximately **1.45 °C/W**, allowing it to dissipate significant heat despite its small size. #### C. Thermal Interface Material (TIM) The "R0" suffix indicates that this part typically comes with **pre-applied thermal interface material**. This eliminates the need for manual application of thermal paste, ensuring a uniform layer for optimal heat transfer. --- ### 3. Common Applications This part is typically used in space-constrained electronic environments: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Voltage regulators and power transistors. ---