The **ATS-19F-01-C1-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. This component belongs to their "push pin" series, designed primarily for cooling electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions** | 40mm x 40mm x 6mm | | **Fin Style** | Straight Fin | | **Attachment Type** | Push Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface (TIM)** | T766 (Pre-applied phase change material) | | **Thermal Resistance** | 21.90 °C/W (at 200 LFM) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's characteristics: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **19F:** Product series/family. * **01:** Specific sizing/dimension profile. * **C1:** Material and finish (typically refers to Aluminum with Blue Anodize). * **R0:** Revision or packaging code. --- ### 3. Electronic Application & Usage This part is not an active electronic component (like a transistor) but a **passive thermal management component**. Its primary roles are: 1. **Heat Dissipation:** It increases the surface area of a chip, allowing heat to transfer more efficiently to the surrounding air. 2. **Mechanical Attachment:** The "Push Pin" mechanism ensures a consistent downward force on the component, which is critical for maintaining contact with the Thermal Interface Material (TIM). 3. **Low Profile Design:** At only 6mm in height, it is specifically designed for space-constrained environments such as: * 1U Servers. * Network Switches. * Embedded Computing boards. --- ### 4. Thermal Performance Comparison Thermal resistance indicates how effectively the heat sink removes heat (lower values are better). Performance improves as airflow (LFM - Linear Feet per Minute) increases: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 21.92 | | 400 (2.0 m/s) | 12.01 | | 600 (3.0 m/s) | 9.23 |